Abstract: The present invention discloses a MEMS (Micro-Electro-Mechanical System) integrated chip with cross-area interconnection, comprising: a substrate; a MEMS device area on the substrate; a microelectronic device area on the substrate; a guard ring separating the MEMS device area and the microelectronic device area; and a conductive layer on the surface of the substrate below the guard ring, or a well in the substrate below the guard ring, as a cross-area interconnection electrically connecting the MEMS device area and the microelectronic device area.
Type:
Grant
Filed:
August 22, 2011
Date of Patent:
April 22, 2014
Assignee:
Pixart Imaging Inc., R.O.C.
Inventors:
Hsin-Hui Hsu, Chuan-Wei Wang, Sheng-Ta Lee