Abstract: The present invention provides an electrode array for a medical implant device, comprising a substrate supporting a plurality of electrodes, the substrate comprising at least two layers of material including a first layer and a second layer, wherein the first layer of material and the second layer of material have different coefficients of thermal expansion. The plurality of electrodes may be supported on the first layer of material, and are preferably incorporated in and/or project from the second layer of material. The second layer of material may itself have a layered structure comprising multiple material layers, with the plurality of electrodes incorporated within the said multiple material layers. The first layer of material preferably has a higher coefficient of thermal expansion than the second layer of material. The invention furthermore provides a medical implant device including an electrode array according to the invention, and a method of manufacturing such an electrode array.

Abstract: The object,—to create a printed circuit board for an implant having improved properties in connection with the electrical contacting via the contact points of the conductor tracks on the printed circuit board,—is achieved, according to the present invention, by means of a device for contacting and/or electrostimulation of living tissue cells or nerves with having a printed circuit board having with at least one contact point for electrical contacting, the printed circuit board encompassing comprising a flexible multilayer system with at least one conductor track. In accordance with the invention, the contact points for the conductor track in the multilayer system are galvanically reinforced. To this end, a galvanically reinforced layer is grown onto the already preprocessed contact point, for example by means of a galvanic process.