Patents Assigned to Planar Circuit Technologies, Inc.
  • Resistive laminate for printed circuit boards, method and apparatus for forming the same
    Patent number: 5039570
    Abstract: A relatively large dimensioned sputter coated resistive laminate providing uniform laminate dimensions and resistance tolerances over the surface area thereof and a method for making the laminate from a foil, including a platten support step and a sputter etching or cleaning step. The laminate comprises a sputter coated metal foil which is isostatically bonded to an insulative, epoxy resin substrate. In a preferred construction a nickel-chrome-aluminum-silicon resistive layer is applied to a copper foil.
    Type: Grant
    Filed: April 12, 1990
    Date of Patent: August 13, 1991
    Assignee: Planar Circuit Technologies, Inc.
    Inventor: Christian W. Sturm