Abstract: A process for superpolishing hard ceramic substrates, and super polished substrates having surface finishes below about 20 angstroms RMS. In the first embodiment, the process comprises applying a pitch to a lap tool and forming channels in the pitch. The pitch is wetted with a polishing compound comprising colloidal alumina and powder of a substance harder than that being polished. The substrate is brought into contact with the wetted pitch, and relative motion is applied thereto to polish the substrate. In a second embodiment, microporous pads are used which absorb the polishing compound and contact the substrate to polish the same.