Patents Assigned to Plansee Aktiengesellschaft
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Patent number: 7390456Abstract: Highly dense shaped parts are produced with a powder metallurgic process. The parts are formed of an alloy that, besides of at least 20 weight % chromium, consists of iron and one or several additional alloy portions that in sum do not amount to more than 10 weight %. The part is produced by pressing and sintering to near final shape a ready-to-press powder where the additional alloy portions are introduced in form of a master-alloy powder. The master-alloy may contain the following variations: the additional alloy portions and the iron portions; or the additional alloy portions, the iron parts, and the chromium portions; or additional alloy portions and the chromium portions.Type: GrantFiled: September 10, 2002Date of Patent: June 24, 2008Assignee: Plansee AktiengesellschaftInventors: Wolfgang Glatz, Martin Janousek, Wolfgang Kraussler, Gebhard Zobl, Reinhold Zach
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Patent number: 6998180Abstract: A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure.Type: GrantFiled: March 24, 2003Date of Patent: February 14, 2006Assignee: Plansee AktiengesellschaftInventors: Arndt Lüdtke, Heiko Wildner
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Patent number: 6913790Abstract: The resistivity of an electrically conductive layer of molybdenum or a molybdenum alloy is reduced. For that purpose, a MoO2 layer is formed on the surface of the electrically conductive layer. The sheet resistivity can thereby be reduced in the order of magnitude of 10% to 15%.Type: GrantFiled: August 27, 2002Date of Patent: July 5, 2005Assignee: Plansee AktiengesellschaftInventors: Arno Schintlmeister, Peter Wilhartitz
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Patent number: 6914330Abstract: A module serves as a heat sink for semiconductor components. The module includes a diamond/composite substrate that carries a multilayer coating on at least one substrate surface and a housing frame made from ceramics which is soldered onto the substrate. The module excellently fulfills the demands imposed on it, namely a good ability for areally joining to the semiconductor component, a high heat transfer through the joining zone and a good electrical conductivity of the module in the joining zone.Type: GrantFiled: September 23, 2003Date of Patent: July 5, 2005Assignee: Plansee AktiengesellschaftInventors: Günter Kneringer, Arndt Lüdtke
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Patent number: 6908588Abstract: The invention relates to a process for manufacturing an evaporation source for physical vapor deposition. The evaporation source is formed of the actual sputtering target with an aluminum component and one or more further components as well as of a backing plate made from a material having better thermal conductivity than the target. The backing plate made of a powdery starting material is pressed, together with the powdery components of the sputtering target, into sandwiched powder fractions and then formed.Type: GrantFiled: June 12, 2002Date of Patent: June 21, 2005Assignee: Plansee AktiengesellschaftInventors: Peter Wilhartitz, Stefan Schönauer, Peter Polcik
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Patent number: 6907661Abstract: Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned and the canning foil is tightly pressed onto the surface contour of the structural components. Then the components are joined to a composite component by forming a material-to-material bond between the metal canning foils. This widens the hitherto highly restricted field of technical application for materials of this type.Type: GrantFiled: April 30, 2002Date of Patent: June 21, 2005Assignee: Plansee AktiengesellschaftInventor: Peter Rödhammer
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Publication number: 20040239253Abstract: A cold cathode fluorescent lamp (1) has feedthrough pins (5) made from molybdenum or a molybdenum alloy that form a glass-metal seal (6) with a glass composed of 55-75 wt. % SiO2, 13-25 wt. % B2O3, 0-10 wt. % Al2O3, 5-12 wt. % alkali oxides, 0-3 wt. % alkali earth oxides, 0-5 wt. % ZrO2, 0-10 wt. % TiO2 und 0-5 wt. % remaining oxides. The lamp has hollow cathodes (4) made from a material of the group molybdenum, molybdenum alloys, niobium, niobium alloys, and the lamp is manufactured in a compact form using conventional manufacturing parameters, and the resulting lamp has crack free, long-term vacuum-tight glass-metal seals.Type: ApplicationFiled: May 27, 2004Publication date: December 2, 2004Applicants: Plansee Aktiengesellschaft, Schott GlasInventors: Herman Walser, Wolfram Knabl, Gerhard Leichtfried, Jorg Hinrich Fechner, Franz ott, Ralf Diezel, Brigitte Hueber
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Patent number: 6805759Abstract: A shaped part or article of manufacture is formed of a selected gamma titanium aluminide alloy with outstanding mechanical properties which can be produced particularly economically. First, a semi-finished article is formed in a hot forming process with a degree of deformation of greater than 65%. Then the semi-finished article is shaped with the alloy being in a solid-liquid phase by applying mechanical forming forces during at least part of the shaping process.Type: GrantFiled: November 7, 2003Date of Patent: October 19, 2004Assignee: Plansee AktiengesellschaftInventors: Andreas Hoffmann, Heinrich Kestler
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Patent number: 6796162Abstract: The tungsten/heavy metal alloy is suitable for tools such as extrusion dies and extrusion mandrels for the hot-forming of copper and copper alloys. The novel alloy consists of 80 to 89.9% by weight of tungsten, 2 to 7% by weight of chromium, and a remainder of binder metal. The use of the novel alloy primarily results in a considerably reduced formation of grooves on the surface of the forming tools.Type: GrantFiled: December 19, 2001Date of Patent: September 28, 2004Assignee: Plansee AktiengesellschaftInventors: Norbert Dreer, Robert Grill, Joachim Resch
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Patent number: 6753650Abstract: A method for producing an electric lamp having a vitreous lamp bulb and a foil of molybdenum or a doped molybdenum alloy which is pinched in the lamp bulb includes post-treating the unfinished foil such that substantially non-contiguous, insular regions of material agglomerates are formed. The material agglomerates are formed of molybdenum, molybdenum alloys, titanium, silicon, an oxide, a mixed oxide and/or an oxidic compound, with a vapor pressure of in each case less than 10 mbar at 2000° C. The substantially non-contiguous, insular regions are formed on at least 5 percent and at most 60 percent of the area of the foil surface. In this way, the adhesive strength between the foil and the glass and therefore also the service life of the lamp are significantly improved.Type: GrantFiled: May 18, 2001Date of Patent: June 22, 2004Assignee: Plansee AktiengesellschaftInventors: Gerhard Leichtfried, Bernhard Retter, Manfred Sulik
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Patent number: 6737186Abstract: The ferritic iron alloy is particularly suitable as a material for current collectors used in SOFC solid electrolyte high-temperature fuel cells. The material has a high chromium content upwards of 22% by weight, and a molybdenum content of 1 to 10% by weight. Additionally, there is provided 0.01 to 1.5% by weight of yttrium, rare earth metals, and/or their oxides. The alloy in particular has a high resistance to corrosion under the standard cell atmospheres in the temperature range from 700° to 900° C.Type: GrantFiled: May 31, 2002Date of Patent: May 18, 2004Assignee: Plansee AktiengesellschaftInventors: Martin Janousek, Wolfgang Glatz, Kaspar Honegger
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Patent number: 6565988Abstract: The invention provides a component or composite part, such as a divertor plate for the “first wall” of a fusion reactor, adapted to endure a high thermal load, which is made, at least in some sections, of tungsten or a tungsten alloy. In accordance with the invention, the sections are not constructed massively from tungsten or a tungsten alloy, but rather are made as a laminated packet, in order to improve the susceptibility to fissures.Type: GrantFiled: May 9, 2000Date of Patent: May 20, 2003Assignee: Plansee AktiengesellschaftInventors: Laurenz Plöchl, Florian Rainer
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Patent number: 6443354Abstract: The invention provides a process for the production of a composite structural part which can withstand high thermal stress, consisting of at least one graphite part and at least one metal part made of a hardenable copper alloy. In accordance with the invention, the metal part is bonded, by a hot isostatic press process, with the graphite part, which has a layer made of copper or a copper alloy on the bonding surface. In this way, it is possible to use copper-chromium-zirconium alloys with more complex composite structural part constructions and with thin-wall parts of the metal component, without the good mechanical characteristics of the copper-chromium-zirconium alloy being destroyed.Type: GrantFiled: January 24, 2000Date of Patent: September 3, 2002Assignee: Plansee AktiengesellschaftInventors: Laurenz Plochl, Bertram Schedler
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Patent number: 6214474Abstract: The invention relates to a parent substance consisting of a high-melting point metal and an oxidation protective coating made of silicides or aluminides. In accordance with the invention, a reaction barrier layer is placed between the parent substance and the oxidation protective coating, and the oxidation protective coating is alloyed with one or more metals selected from group consisting of molybdenum, niobium, tantalum, and hafnium in a total proportion of 2 to 35 at. %.Type: GrantFiled: October 26, 1998Date of Patent: April 10, 2001Assignee: Plansee AktiengesellschaftInventors: Roland Barbist, Wolfram Knabl, Hans-Peter Martinz, Peter Rodhammer