Patents Assigned to Plasma Technology Corporation
  • Publication number: 20070274020
    Abstract: The electrostatic chuck comprises a chuck base for supporting a wafer, a dielectric film mounted on the chuck base, the dielectric film having an electrode for supplying direct current voltage to provide an electrostatic force to fix the wafer, the electrode disposed in the dielectric film, and a cooling channel for supplying refrigerant to the dielectric film to control the temperature of the wafer.
    Type: Application
    Filed: December 22, 2004
    Publication date: November 29, 2007
    Applicant: ADAPTIVE PLASMA TECHNOLOGY CORPORATION
    Inventors: Hee Park, Jin Kim, Kyu Lee, Kwan Park, Sang Oh, Hwi Jang
  • Publication number: 20030180971
    Abstract: Disclosed is plasma etching method and apparatus for manufacturing a semiconductor device. The plasma etching apparatus includes a chamber in which a wafer to be etched is loaded, at least one CCD, at least one gas supply unit for supplying etching gases into the chamber; and at least one state control unit. The state control unit comprises a light component extractor, a estimator, a comparator, a controller, and a timer. The plasma etching apparatus also comprises a chamber in which a wafer to be etched is loaded; a first dome sealing an upper end of the chamber; a coil winded on the dome and generation electric field into the chamber; at least one light emission tip disposed through a predetermined portion of the dome, so as to emit light toward the wafer and receive light reflected by the wafer; and a plurality of nozzles, each of which is disposed around light emission tip and through the, predetermined portion of the dome, so as to supply gases into the chamber.
    Type: Application
    Filed: March 25, 2003
    Publication date: September 25, 2003
    Applicant: Adaptive Plasma Technology Corporation
    Inventors: Nam-Hun Kim, Sheung Ki Kim, Sang Ryong Oh
  • Patent number: 5634414
    Abstract: Municipal or other solid waste is delivered in loose form to a processing facility where it is compacted into a supply chute adjacent the upper portion of a reactor. The compaction serves to remove most of the air and some of the water from the waste as well as to seal the reactor against air infiltration. The supply chute is equipped with a number of pusher units which are capable of pushing a portion of the compacted waste in the form of a block into the reactor. The blocks of compacted waste are deposited in the top of the reactor in response to a signal related to the height of waste in the reactor. A pivotally and extendible mounted plasma arc torch is employed as a heat source to pyrolyze organic waste components to generate desired by-product gases. Air and steam are added in controlled quantities to improve the operational efficiency and the by-product gas composition. Residual materials which do not pyrolyze are melted and cooled into a substantially inert vitrified mass.
    Type: Grant
    Filed: July 10, 1996
    Date of Patent: June 3, 1997
    Assignee: Plasma Technology Corporation
    Inventor: Salvador L. Camacho
  • Patent number: 5544597
    Abstract: A system is disclosed in which municipal mixed solid waste is delivered to a processing facility where it is compacted before being placed into a reactor. The compaction apparatus serves to remove most of the air and some of the water from the waste as well as to seal the reactor against air infiltration. A transfer apparatus, in response to a signal relating to the height of waste in the reactor, sequentially deposits blocks of compacted waste in the top of the reactor when the height is low. The reactor has a pivotally and extensively mounted plasma arc torch as a heat source which is effective to pyrolyze organic waste components to generate desired by-product gases. Air and steam are added in controlled quantities to improve the operational efficiency and the by-product gas composition. The residual materials which do not pyrolyze are melted and cooled into a substantially inert vitrified mass.
    Type: Grant
    Filed: August 29, 1995
    Date of Patent: August 13, 1996
    Assignee: Plasma Technology Corporation
    Inventor: Salvador L. Camacho
  • Patent number: 5497710
    Abstract: The present invention provides an apparatus for the melting and subsequent solidification of fine particulate material by means of a plasma torch. The fine particulate material is introduced into a furnace having a plasma torch to a depth sufficient to cover the plasma flame produced by the torch. When operative, the torch generates a heat at low gas flow, which both allows the fine particulate material to rest with little disturbance and to transfer large amounts of heat energy to the fine particulate, effectively preheating the fine particulate material for more efficient melting. The melt may, for example, be solidified into a block for building use, into fibers by means of pressurized air passed through a venturi nozzle or into other useful forms.
    Type: Grant
    Filed: December 13, 1994
    Date of Patent: March 12, 1996
    Assignee: Plasma Technology Corporation
    Inventor: Salvador L. Camacho