Abstract: A high production rate plasma sputtering process for producing particles having a size of 10 ?m or less is disclosed. The process causes ionization of at least a part of the sputtered target atoms and is performed at such parameters that the pick-up probability of ionized sputtered target atoms on the surface of grains is high.
Type:
Grant
Filed:
February 22, 2011
Date of Patent:
September 20, 2016
Assignee:
Plasmadvance AB
Inventors:
Ulf Helmersson, Nils Brenning, Daniel Soderstrom