Abstract: This present invention relates to a contact (100) for electronic devices (1). More specifically, a contact (100) for electronic devices (1) has an upper contact pin (110) which includes a contact part (111) having a predetermined shape and contacting a lead of an object to be tested, that is, an integrated circuit (IC) (1), two support protrusions (112, 113) and a body (118); a lower contact pin (130) coupled to the upper contact pin (110) to be orthogonal to the upper contact pin (110); and a spring (190) fitted over a predetermined area between the upper and lower contact pins (110, 130).

Abstract: A compression mount receptacles (16) is provided for mounting test and burn-in sockets (14) to surface mount pads of circuit boards (18). The receptacle (16) includes coil spring contacts (52) having active portions provided by loosely wound coils (54) which provide compliance for accommodating tolerances and changes in distances between the test and burn-in sockets (14) and the circuit boards (18). The coil spring contacts (52) further include first and second end portions (56, 58), with some of the end portions (56) being formed of close wound coils in which adjacent coils are in contact to provide lineal circuit paths. Conductive contact tangs (60) extend within respective ones of the coil spring contacts (52) and provide substantially lineal circuit paths which electrically connect between respective ones of first and second electrical contacts (22, 20), providing a shortened contact circuit across the loosely wound coils (54) of the coil spring contacts (52).

Abstract: Ball grid array devices are mounted in a burn-in and test socket which has a top surface sockets which have top surfaces with windows for the ball terminals terminal balls depending from the ball grad grid array device. Contact fingers mounted on the base of the socket extend through a bending plate and into the windows from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals terminal balls. The ends of the contact members are urged into contact with the ball terminals terminal balls between the center of the ball terminal ball and the surface of the ball grid array device, thus retaining the device in the socket.