Abstract: A desoldering wick dispenser In an embodiment of combined package and tube, the package has a funnel shaped housing containing a coil of desoldering wick. An end portion of the desoldering wick extends through and beyond the outer end of a tube extending from the center of the housing. The coil of desoldering wick is a spiral having a conical shape approximately complementary to the end of the housing. Alternatively, the coil may be a helically wound spool of wick in a somewhat more elongated tubular housing. The end of the wick extending through the tube is drawn from the center of the coil. The tube may be metal or plastic and may be a continuous or split tube, or formed from a helically coiled wire. The wick is manipulated by the tube when used.

Abstract: A desoldering wick dispenser includes a conventional wick package in the form of a bowl with a central hub and a flat cover mounted on the hub and having a gap between the edge of the cover and the outer edge of the bowl. A desoldering wick is coiled in the bowl around the hub and an end portion passes through the gap is drawn through a tube so that an end of the wick extends beyond the end of the tube. The wick is manipulated by the tube when used. In an embodiment of combined package and tube, the package has a funnel shaped housing containing a coil of desoldering wick. An end portion of the desoldering wick extends through a tube extending from the center of the housing. The coil of desoldering wick is a spiral having a conical shape approximately complementary to the end of the housing. Alternatively, the coil may be a helically wound spool of wick in a somewhat more elongated tubular housing. The end of the wick extending through the tube is drawn from the center of the coil.

Abstract: Safety shears which include two arms connected by a pin, each arm including a cutting blade and a handle, wherein at least one of the handles includes a weakened portion such that in operation that handle will break before either cutting blade.

Abstract: A desoldering wick is made from an elongated strip of woven wire mesh slit from a sheet of woven fabric. The wire mesh is folded longitudinally for forming a ribbon having a width less than the width of the strip and having multiple thicknesses of wire mesh with a plurality of spaces between adjacent layers of mesh. The surface of the wire mesh is wettable by molten solder and may be coated with a solder flux for enhancing wetting. A variety of embodiments have folded woven fabric to make three or more thicknesses of wire mesh and are folded so that both slit edges of the strip are inside of the ribbon. Large area desoldering wicks are in the form a pad with a flat face and at least one edge folded approximately normal to the flat face. A ribbon desoldering wick is mounted in an insulating tube for faciltating holding the wick.

Abstract: A dropper bottle employs a conventional flexible bottle and cover with a conical tip having a hole in the end. An adapter is captured between the mouth of the bottle and cover and includes a generally conical extension. The extension seals inside the ferrule of a needle which is jammed inside the tip, with the needle protruding through the hole. The adapter seals between the mouth of the bottle and the ferrule of the needle and includes a passage for fluid between the bottle and the needle.

Abstract: A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as the circuit component. At least a pair of integral sides along opposite edes of the top are bent normal to the top and are not further apart than the outside of the electrical leads on the opposite sides of the circuit component for good thermal contact therewith. The depth of the inside of the box is greater than the height of the top of the component so that there is no contact between the top of the box and the top of the component. The top of the box over the component is heated sufficiently to melt solder on the electrical leads. The box and component can then be lifted together from the printed circuit board.

Abstract: A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as the circuit component. At least a pair of integral sides along opposite edges of the top are bent normal to the top and are not further apart than the outside of the electrical leads on the opposite sides of the circuit component for good thermal contact therewith. The depth of the inside of the box is greater than the height of the top of the component so that there is no contact between the top of the box and the top of the component. The top of the box over the component is heated sufficiently to melt solder on the electrical leads. The box and component can then be lifted together from the printed circuit board.

Abstract: A soldering iron tip comprises a copper body with a layer of glass bonded on the surface. The portion of the body used for melting solder is not coated. The glass is opaque to infrared, has high, uniform and stable emissivity, helps prevent oxidation, limits wetting of the tip by solder, and is easily kept clean. The glass is readily applied to a soldering iron tip by melting a frit. Such a glass layer provides electrical insulation from a soldering iron and prevents leakage electric current from damaging sensitive components. A method is provided for measuring temperature of an article during soldering by applying a glass which absorbs infrared to a portion of the article and measuring infrared emittance from the glass during soldering.