Patents Assigned to Plessey, Inc.
  • Stamping tools
    Patent number: 4205548
    Abstract: Tools for stamping very delicate lead frames for semiconductor packages, including scored and bent-up tabs that retain groups of inner lead tips in position through subsequent operations, after which they are broken off. Sequential punch and die sets are used to (1) define the tabs, (2) bend down the leads, (3) score the tabs and coin the lead tips, and (4) bend the tabs up. At stations (3) and (4) means are provided to lift scored tabs out of the die and to allow the frame strip to move over the tab-bending die without interference.
    Type: Grant
    Filed: July 3, 1978
    Date of Patent: June 3, 1980
    Assignee: Plessey, Inc.
    Inventors: Herbert Bothner, John M. Frusco, Dieter Spieth