Abstract: A liquid delivering system for wafer cleaning equipment includes an acid scouring tank, a sulfuric acid supplying source, a hydrogen peroxide supplying source, a first mixing device, a second mixing device and a feedback-control panel. The first mixing device and the second mixing device both includes a mixing duct, a multi-section mixing screw rod arranged inside the mixing duct and a heater wrapped around the mixing duct. By ways of adopting the above-mentioned technical solution, it is possible to realize fully mixing sulfuric acid with hydrogen peroxide in a mode of mixing in multi-stages, achieve precise control to temperature, and enable mixed liquid to fully react, thereby ensuring that the mixed liquid coming into the acid scouring tank meets cleaning requirements, and improving quality and efficiency of cleaning wafers.
Type:
Grant
Filed:
January 16, 2025
Date of Patent:
June 17, 2025
Assignees:
PNC PROCESS SYSTEMS CO., LTD., ULTRON SEMICONDUCTOR (SHANGHAI) CO., LTD.
Inventors:
Yilin Shen, Xinlai Chen, Dawei Liu, Jie Wang, Zhengkai Lu, Ming Xu, Panpan Li, Fangyi Lv, Chuanlong Liu