Abstract: Provided is a method of mounting a chip. The method includes: forming a bump at one surface of a cavity formed concavely in an inner direction of a substrate; performing a coining process to flatten a surface of the bump; coating a solder material on the bump subjected to the coining process; and bonding a chip and the bump by melting the solder material, wherein an electrode portion or a metal portion is formed on a bottom of the chip. For a metal substrate according to the present invention, wherein a vertical insulating layer is included, since the electrode portion of the chip and the electrode portion of the substrate have to be electrically connected, the metal substrate is bonded to the electrode portion of the chip using the bump additionally formed on the metal substrate, so the heat generated in the chip can be rapidly transferred to the substrate, and the junction temperature of the chip can be decreased, thereby enhancing the light efficiency and the.