Abstract: The method for assembling a microelectronic chip device (101) in a fabric (104) comprises the following steps: providing a microelectronic chip device (101) comprising a base (102) and a protruding element (103) rising from a face of the base (102), said protruding element (103) comprising a free end opposite the base (102); inserting into the fabric (104) the chip device (101) by the free end of the protruding element; deforming the protruding element (105) at its free end so as to ensure the securing of the chip device (101) with the fabric (104) by forming a crimping bead (106).
Type:
Grant
Filed:
April 24, 2012
Date of Patent:
April 16, 2019
Assignees:
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, POLE EUROPEEN DE PLASTURGIE
Inventors:
Jean Brun, Delphine Christophe, Lionel Tenchine
Abstract: The method for assembling a microelectronic chip device (101) in a fabric (104) comprises the following steps: providing a microelectronic chip device (101) comprising a base (102) and a protruding element (103) rising from a face of the base (102), said protruding element (103) comprising a free end opposite the base (102); inserting into the fabric (104) the chip device (101) by the free end of the protruding element; deforming the protruding element (105) at its free end so as to ensure the securing of the chip device (101) with the fabric (104) by forming a crimping bead (106).
Type:
Application
Filed:
April 24, 2012
Publication date:
October 23, 2014
Applicants:
Pole Europeen de Plasturgie, Commissariat a L'energie atomique et aux energies Alternatives
Inventors:
Jean Brun, Delphine Christophe, Lionel Tenchine