Patents Assigned to Poly-Bond, Inc.
  • Patent number: 5705011
    Abstract: A composite includes a first substrate, a second substrate, and a discontinuous adhesive structure disposed intermediate the first and second substrates for securing the first and second substrates together to form a composite without significantly modifying the properties of either of the first and second substrates. The discontinuous adhesive structure is an array of substantially linear filaments or strands of an adhesive.
    Type: Grant
    Filed: February 15, 1995
    Date of Patent: January 6, 1998
    Assignee: Poly-Bond, Inc.
    Inventors: Carl Allen Bodford, Stephen O. Chester, Rahul Krishnakant Nayak
  • Patent number: 5643239
    Abstract: A breathable diaper, feminine hygiene, or like disposable sanitary product construction includes a plurality of materials comprising, from the skin-facing side outwardly a topsheet of liquid- and vapor-permeable hydrophilic material. A core of highly absorbent material disposed outwardly of the topsheet for absorbing fluid received through said topsheet. The core has an inner surface in fluid communication with the topsheet, an outer surface and two lateral side surfaces. A barrier is formed of a multilayer non-woven material which is hydrophobic and vapor-permeable for limiting the outward escape of fluid therethrough while enabling the outward escape of heat and water vapor therethrough, such as a two-layer spunbond-meltblown or a three-layer spunbond-meltblown-spunbond.
    Type: Grant
    Filed: November 3, 1995
    Date of Patent: July 1, 1997
    Assignee: Poly-Bond, Inc.
    Inventors: Carl Allen Bodford, Rahul Krishnakant Nayak
  • Patent number: 5589249
    Abstract: A composite includes a first substrate, a second substrate, a third substrate and a discontinuous adhesive structure disposed intermediate the first and second and the second and third substrates for securing the first, second and third substrates together to form a composite without significantly modifying the properties of any of the substrates. The discontinuous adhesive structure is an array of substantially linear filaments or strands of an adhesive. The composite combines high moisture vapor transmission, high resistance to penetration by liquids and high resistance to viral penetration even at a pressure of at least 3 psi, thereby rendering it suitable for medical applications such as surgical gowns, etc.
    Type: Grant
    Filed: July 18, 1995
    Date of Patent: December 31, 1996
    Assignee: Poly-Bond, Inc.
    Inventors: Carl A. Bodford, Stephen O. Chester, Rahul K. Nayak
  • Patent number: 5523146
    Abstract: A composite includes a first substrate, a second substrate, and a discontinuous adhesive structure disposed intermediate the first and second substrates for securing the first and second substrates together to form a composite without significantly modifying the properties of either of the first and second substrates. The discontinuous adhesive structure is an array of substantially linear filaments or strands of an adhesive.
    Type: Grant
    Filed: April 11, 1995
    Date of Patent: June 4, 1996
    Assignee: Poly-Bond, Inc.
    Inventors: Carl A. Bodford, Stephen O. Chester, Rahul K. Nayak
  • Patent number: 5342469
    Abstract: A composite includes a first substrate, a second substrate, and a discontinuous adhesive structure disposed intermediate the first and second substrates for securing the first and second substrates together to form a composite without significantly modifying the properties of either of the first and second substrates. The discontinuous adhesive structure is an array of substantially linear filaments or strands of an adhesive.
    Type: Grant
    Filed: January 8, 1993
    Date of Patent: August 30, 1994
    Assignee: Poly-Bond, Inc.
    Inventors: Carl A. Bodford, Stephen O. Chester, Rahul K. Nayak