Patents Assigned to Poly Circuits/M-Wave
  • Circuit board assembly with foam substrate and method of making same
    Patent number: 5733639
    Abstract: A laminated circuit board comprising a high frequency, low dielectric, and low dissipation factor foam substrate layer and at least one metal cladding layer laminated to the foam substrate layer. The foam substrate layer is formed of a closed-cell polyisocyanurate rigid foam having a closed-cell structure greater than 95%.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: March 31, 1998
    Assignee: Poly Circuits/M-Wave
    Inventor: Daniel T. Gosselin