Patents Assigned to Poly-Flex Circuits Limited
  • Patent number: 7642126
    Abstract: The method uses a laser beam directed through the substrate to the conductive area of the substrate in order to bond the two together.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: January 5, 2010
    Assignee: Poly-Flex Circuits Limited
    Inventors: Neil Kirby, John Jefferies