Patents Assigned to Polycomp, Inc.
  • Method of prepregging with resin and novel prepregs produced by such method
    Patent number: 7297740
    Abstract: Disclosed is a process of forming a prepreg material having substantially no voids. According to the process of the invention, the reinforcing material is heated to a temperature above the temperature of the impregnating resin. The prepreg formed has substantially no voids and does not require lengthy consolidation when formed into useful articles.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: November 20, 2007
    Assignee: Polycomp, Inc.
    Inventor: Joel A Dyksterhouse