Patents Assigned to Polylithics, Inc.
  • Method of making a extended integration semiconductor structure
    Patent number: 5192716
    Abstract: A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding the aligned and attached integrated substrate, and the support substrate is removed. Reach-through vias connect the decal wiring to the chips.
    Type: Grant
    Filed: July 24, 1991
    Date of Patent: March 9, 1993
    Assignee: Polylithics, Inc.
    Inventor: Scott L. Jacobs