Patents Assigned to Polymer Flip Chip Corporation
  • Flip chip mounting technique
    Patent number: 6410415
    Abstract: The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: June 25, 2002
    Assignees: Polymer Flip Chip Corporation, Toray Engineering Co., Ltd.
    Inventors: Richard H. Estes, James E. Clayton, Koji Ito, Masanori Akita, Toshihiro Mori, Minoru Wada
  • Method of forming electrically conductive polymer interconnects on electrical substrates
    Patent number: 6138348
    Abstract: A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating on the second substrate. The electrically conductive polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: October 31, 2000
    Assignee: Polymer Flip Chip Corporation
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Method of forming electrically conductive polymer interconnects on electrical substrates
    Patent number: 5918364
    Abstract: A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: July 6, 1999
    Assignee: Polymer Flip Chip Corporation
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Method for forming electrically conductive polymer interconnects on electrical substrates
    Patent number: 5879761
    Abstract: A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating on the second substrate. The electrically conductive polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
    Type: Grant
    Filed: July 18, 1995
    Date of Patent: March 9, 1999
    Assignee: Polymer Flip Chip Corporation
    Inventors: Frank W. Kulesza, Richard H. Estes