Abstract: A radiation curable solder mask inkjet ink contains a photo-initiator, a polymerizable compound and a flame retardant wherewith a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties and flame retardancy may be produced.

Abstract: The invention provides an inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board. By using a solder mask inkjet ink containing at least one photoinitiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter, a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties, may be produced.

Abstract: A method of manufacturing an electronic device includes preparing a solder mask with a radiation curable solder mask inkjet ink containing at least one cationic polymerizable compound and a photoinitiating system, wherein the photoinitiating system includes a specified sulphonium compound and a thioxanthone.

Abstract: A jettable composition is described, comprising a reactive monomer, oligomer or prepolymer containing at least one epoxy or oxetane functional group; a free radical polymerizable compound; a thermal cross-linking agent; and a radical initiator, along with an electronic device having the composition jetted thereon and a method of manufacturing an electronic device.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Abstract: A polybutylene terephthalate resin composition containing a polybutylene terephthalate resin, a silicone-based compound having a kinematic viscosity at 25° C. of 1,000 to 10,000 cSt in an amount of 0.5 to 1.8% by mass of the total mass of the polybutylene terephthalate resin composition, and an olefin-based elastomer in an amount of 5 to 20% by mass of the total mass of the polybutylene terephthalate resin composition.

Abstract: Compositions and methods for a melt processable semicrystalline poly(aryl ether ketone) incorporating phthalazinone and 4,4?-biphenol as comonomer units are described herein. The polymers are resistant to and insoluble in common organic solvents and liquids as well as in aggressive organic solvents such as chloroform and chlorinated liquids. The polymers are melt processable via techniques such as extrusion, injection molding, and compression molding. The semicrystalline poly(aryl ether ketone) containing phthalazinone comonomer units have properties which make them suitable for manufacturing high temperature resistant molded systems and other articles.

Abstract: A polybutylene terephthalate resin composition containing a polybutylene terephthalate resin, 10 to 20% by mass of glass fiber relative to a total mass of the composition, an ethylene/ethyl acrylate copolymer, and an epoxy compound having an epoxy equivalent weight of 600 to 1,500 g/equivalent, and having a comparative tracking index (CTI) of 600 V or higher, measured in accordance with the third edition of IEC 60112.

Abstract: A flame-retardant composition is described as comprising phosphonate oligomers or polymers of formula (I) as a component (A) an amino ether of formula (II) as a component (B) and a thermoplastic polymer as a component (C), where the components (A), (B) and (C) are as defined.

Abstract: To provide a resin-impregnated fiber bundle that can provide a molded article with a high surface impact strength. A resin-impregnated fiber bundle prepared by impregnating and integrating 100 parts by mass of a bundle of a fiber material (A) with 25 to 300 parts by mass of a thermoplastic resin (B), wherein: the resin-impregnated fiber bundle has a flattened shape with a lateral cross-sectional shape having a major axis and a minor axis (length of the major axis>length of the minor axis); an average length (D1) of the major axis is 0.5 to 2.0 mm; an average flatness ratio (D1/D2) determined from the average length (D1) of the major axis and an average length (D2) of the minor axis is 1.2 to 8.0; the resin-impregnated fiber bundle has a length (L) of 11 to 50 mm and a ratio (L/D1) between L and D1 is 10 to 50; and a bulk density is 0.1 to 0.4 g/cm3.

Abstract: Compositions and methods for a melt processable semicrystalline poly(aryl ether ketone) incorporating phthalazinone and 4,4?-biphenol as comonomer units are described herein. The polymers are resistant to and insoluble in common organic solvents and liquids as well as in aggressive organic solvents such as chloroform and chlorinated liquids. The polymers are melt processable via techniques such as extrusion, injection molding, and compression molding. The semicrystalline poly(aryl ether ketone) containing phthalazinone comonomer units have properties which make them suitable for manufacturing high temperature resistant molded systems and other articles.

Abstract: A polybutylene terephthalate resin composition containing a polybutylene terephthalate resin, 10 to 20% by mass of glass fiber relative to a total mass of the composition, an ethylene/ethyl acrylate copolymer, and an epoxy compound having an epoxy equivalent weight of 600 to 1,500 g/equivalent, and having a comparative tracking index (CTI) of 600 V or higher, measured in accordance with the third edition of IEC 60112.

Abstract: Disclosed are: a polyalkylene terephthalate resin composition comprising (A) a polyalkylene terephthalate resin and (B) an acrylic-based core-shell polymer which has an average particle size of 2 ?m or greater and in which an amount of the core layer component is more than 80% by mass but less than 100% by mass relative to a total mass of the core layer component and a shell layer component; and a molded article which is obtained by molding the polyalkylene terephthalate resin composition.

Abstract: Provided are a polybutylene terephthalate resin composition which is excellent in mold releasability and which can suppress deterioration in molding stability and aggregation of the polybutylene terephthalate resin composition due to blooming of a mold release agent; and a pellet thereof. The polybutylene terephthalate resin composition contains 0.01 to 5.0 parts by mass of (B) a saturated fatty acid ester of a polyglycerol represented by formula (I) described below with respect to 100 parts by mass of (A) a polybutylene terephthalate resin. In formula (I), R1s each may be the same or different and are C19-30 saturated aliphatic acyl groups, and n is an integer from 1 to 10.

Abstract: Provided is a polybutylene terephthalate resin composition having excellent mold releasability, measurement stability and hydrolysis resistance, and exhibiting minimal discoloration under high-temperature conditions. The polybutylene terephthalate resin composition contains: (A) a polybutylene terephthalate resin, (B) a higher fatty acid ester of pentaerythritol, and (C) a low-molecular weight polyethylene having a number-average molecular weight of 3,000 to 7,000. It is preferable that the component (B) is pentaerythritol tetrastearate, and that the component (C) is a low-molecular weight polyethylene having a number-average molecular weight of 4,500 to 5,500.

Abstract: Provided is a polybutylene terephthalate resin composition having excellent mold releasability, measurement stability and hydrolysis resistance, and exhibiting minimal discoloration under high-temperature conditions. The polybutylene terephthalate resin composition contains: (A) a polybutylene terephthalate resin, (B) a higher fatty acid ester of pentaerythritol, and (C) a low-molecular weight polyethylene having a number-average molecular weight of 3,000 to 7,000. It is preferable that the component (B) is pentaerythritol tetrastearate, and that the component (C) is a low-molecular weight polyethylene having a number-average molecular weight of 4,500 to 5,500.

Abstract: To provide a polybutylene terephthalate resin composition offering excellent flowability, wherein the resin composition raises the weld strength and heat shock resistance of a welded body obtained by welding together molded products obtained by molding the polybutylene terephthalate resin composition. [Solution] A polybutylene terephthalate resin composition comprising a polybutylene terephthalate resin (A) having a weight-average molecular weight of 60,000-80,000 inclusive and an inorganic filler (B). Preferably, also included is 5-20 mass parts of an elastomer (C) relative to 100 mass parts of the polybutylene terephthalate resin (A).

Abstract: A sealed mat system discharge of a fluid or a solid material comprises interconnected channels, seals, and a composite panel structure.

Abstract: A hollow article is provided, comprising a first wall and a second wall, where the first and second walls are positioned in opposing relationship and define a space therebetween. A plurality of protruding structural pillars extend from the second wall and span the space, each of the structural pillars having an end surface integrally bonded with an inside surface of the first wall.