Abstract: A method of sealing a gap between construction slabs by deforming and inserting a sealing member of closed cell foam is described. An assembly including a deformed sealing member and construction slabs is disclosed. Also described is a joint seal configured to seal a gap between constructions slabs, which utilizes a deformed sealing member of closed cell foam installed within the gap.

Abstract: Siloxane epoxy materials employed as redistribution layers in electronic packaging and coatings for imprinting lithography, and methods of fabrication are disclosed.

Abstract: Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by U.V. or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film properties after curing, such as good adhesion, flexibility, and appearance. The coating compositions may be clear or may contain fillers, dyes, and pigments. A method for manufacturing a coated metal, plastic, wood, or glass substrate using the compositions is also disclosed, as well as the coated material manufactured by the method.

Abstract: Structures employing siloxane epoxy polymers as diffusion barriers adjacent conductive metal layers are disclosed. The siloxane epoxy polymers exhibit excellent adhesion to conductive metals, such as copper, and provide an increase in the electromigration lifetime of metal lines. In addition, the siloxane epoxy polymers have dielectric constants less then 3, and thus, provide improved performance over conventional diffusion barriers.

Abstract: Semiconductor devices employing siloxane epoxy polymers as low-? dielectric films are disclosed. The devices include a semiconductor substrate, one or more metal layers or structures and one or more dielectric films, wherein at least one dielectric film in the devices is a siloxane epoxy polymer. Use of siloxane epoxy polymers is advantageous, in part, because the polymers adhere well to metals and have dielectric constants as low as 1.8. Thus, the disclosed semiconductor devices offer much better performance than devices fabricated using conventional dielectric materials. Furthermore, the siloxane epoxy polymer dielectrics are fully curable at low temperatures, exhibit low leakage currents, and remain stable at temperatures greater than 400° C.

Abstract: Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by heat or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film properties after curing, such as good adhesion, flexibility, weatherability, and corrosion resistance even in the absence of a chromium-containing filler. The coating compositions may be clear or may contain fillers and/or pigments. A method for manufacturing a coated metal, plastic, wood, or glass substrate using the compositions is also disclosed, as well as the coated material manufactured by the method.

Abstract: Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by U.V. or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film properties after curing, such as good adhesion, flexibility, and appearance. The coating compositions may be clear or may contain fillers, dyes, and pigments. A method for manufacturing a coated metal, plastic, wood, or glass substrate using the compositions is also disclosed, as well as the coated material manufactured by the method.

Abstract: Solventless siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass are disclosed. The compositions are cationically curable in air by heat or by electron beam radiation. The siloxane epoxy coating compositions exhibit excellent film properties after curing, such as good adhesion, flexibility, weatherability, and corrosion resistance even in the absence of a chromium-containing filler. The coating compositions may be clear or may contain fillers and/or pigments. A method for manufacturing a coated metal, plastic, wood, or glass substrate using the compositions is also disclosed, as well as the coated material manufactured by the method.

Abstract: Optical waveguide structures containing siloxane resin composistions as core materials and a method for preparing the waveguides are disclosed. The siloxane resin compositions can be cured by thermal energy or actinic radiation. In addition, conventional patterning techniques can be used, which makes the present method ideal for practicing on a commercial scale. The optical waveguides of the invention exhibit very low optical losses and are compatible with silicon processing requirements, which makes them useful in integrated circuitry. In addition, the high refractive index contrasts between the siloxane resin core and various claddings, including other siloxane resins, makes the waveguides particularly desirable.

Abstract: Diaryliodonium salts are disclosed, as well as a method for preparing them, in which one of the aryl groups bonded to the positively-charged iodine ion contains a methyl substituent, and the other one contains a hydroxyl-substituted alkoxy group. The salts are synthesized from (o, m, or p)- iodotoluene, as opposed to iodobenzene, and therefore do not pose a carcinogenic risk. In addition, the present salts are unexpectedly more soluble in most organic solvents, as well as in nonpolar monomers, than the corresponding benzene catalysts. The salts are useful as cationic photoinitiators, cationic thermal initiators (often combined with a cocatalyst, e.g. copper), and as starting materials in the synthesis of urethane-containing iodonium salts.

Abstract: A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.

Abstract: A process for the selective monoadditon of an olefin or acetylene to a siloxane which contains two reactive Si--H bonds to produce a product in which only one of the two Si--H functions has added across the olefin or acetylene is disclosed. A process for making unsymmetrical siloxanes from symmetrical dihydrosiloxanes and products of both of these processes are also disclosed. Products are represented by the formula I in which R.sup.1 and R.sup.

Abstract: Compositions for photocurable coatings are disclosed. The compositions comprise (a) an epoxidized vegetable oil, (b) a low molecular weight epoxy resin, (c) a photoinitiator for cationic polymerization and (d) a wax. Processes for making and using the coatings are also disclosed as are containers coated according to the invention.