Abstract: High strength and high wear resistance copper alloys consisting essentially of (I) 54-66% by weight of Cu, 1.0-5.0% by weight of Al, 1.0-5.0% by weight of Mn, 0.1-2.0% by weight of Si, 0.1-3.0% by weight of Sn, 0.01-1.0% by weight of B, and as the remainder, Zn and inevitable impurities, and (II) 54-66% by weight of Cu, 1.0-5.0% by weight of Al, 1.0-5.0% by weight of Mn, 0.1-2.0% by weight of Si, 0.1-3.0% by weight of Sn, 0.01-1.0% by weight of B, 0.1-4.0% by weight of one or more elements selected from Fe, Ni and Cr, and as the remainder, Zn and inevitable impurities.

Abstract: This invention provides an economic copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The copper alloy comprises a composite of copper and inexpensive elements comprising 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In one preferred embodiment a specific weight % of iron is also added. Still further, an improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening. Other advantageous properties comprise desirable elongation.