Abstract: Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the container. The electronic module is configured to operate reliably at or above a maximum manufacturer's suggested first ambient temperature while still maintaining the first suggested operating core temperature of the internal electronic module. The system further includes a duct in fluid communication with at least one of the openings and an exterior flow device coupled to the duct.
Type:
Grant
Filed:
May 16, 2006
Date of Patent:
August 11, 2009
Assignees:
Pacific Star Communications, Portland Design Studio, Inc.
Abstract: Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the container. The electronic module is configured to operate reliably at or above a maximum manufacturer's suggested first ambient temperature while still maintaining the first suggested operating core temperature of the internal electronic module. The system further includes a duct in fluid communication with at least one of the openings and an exterior flow device coupled to the duct.
Type:
Application
Filed:
May 16, 2006
Publication date:
March 15, 2007
Applicants:
Pacific Star Communications, Inc., Portland Design Studio, Inc.