Abstract: An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.

Abstract: A light emitting module according to an exemplary embodiment of the present invention includes a printed circuit board (PCB) and first through m-th lighting blocks (‘m’ is an integer greater than one). The PCB has wiring patterns electrically connecting optical semiconductor devices. The first through the m-th lighting blocks are disposed on the PCB and configured to generate light. Each of the first through the m-th lighting blocks includes first through n-th lighting groups (each block includes at least one group), each of which includes optical semiconductor devices disposed on the PCB, and an electric currents configured to flow through each lighting group is substantially the same.

Abstract: Embodiments of the invention provide an optical semiconductor illuminating apparatus, which includes a heat dissipating base; a light emitting module comprising at least one semiconductor light emitting device and mounted on a lower side of the heat dissipating base; and a plurality of heat dissipating fins each having opposite edges protruding from opposite sides of the heat dissipating base and being mounted on an upper surface of the heat dissipating base.

Abstract: A lighting apparatus includes a housing, a light emitting module disposed on an open region at one side of the housing, and a heat sink unit placed within the housing to absorb and discharge heat from the light emitting module. The light emitting module includes a heat sink base on which a semiconductor optical device is mounted. The heat sink unit includes at least one main heat pipe having one side adjoining the heat sink base and a heat sink block adjoining the other side of the main heat pipe to cooperate with the main heat pipe.

Abstract: An LED luminaire according to an exemplary embodiment of the present invention includes a rectifier outputting a first rectified voltage generated by rectifying AC voltage and flattening the rectified voltage, a power factor correction unit receiving the first rectified voltage output from the rectifier and generating and outputting a drive voltage, an LED light emitting unit including first to m-th light emitting groups each including at least one LED, the LED light emitting unit sequentially driven by receiving the drive voltage input from the power factor correction unit, and an LED drive IC determining a voltage level of the drive voltage upon receiving the drive voltage input from the power factor correction unit, and controlling sequential driving of the first to m-th light emitting groups according to the determined voltage level of the drive voltage.

Abstract: An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.

Abstract: A optical semiconductor lighting apparatus includes: a board; a drive IC which is disposed in a central portion of the board; a plurality of semiconductor optical devices which is disposed adjacent to and around the drive IC in the board in a grid shape in one or more rows and columns; a non-insulating heat sink in which the board is disposed; an insulating housing which accommodates the heat sink and protects the drive IC and the plurality of semiconductor optical devices from withstand voltages; and a first optical member which faces the plurality of semiconductor optical devices, transmits or reflects light irradiated from the semiconductor optical devices, and forms a vertical vent hole corresponding to the drive IC; and a second optical member which is connected to an upper side of the housing and forms light distribution by refracting light transmitted or reflected from the first optical member.

Abstract: Embodiments of the invention provide AC LED lighting apparatuses. The AC LED lighting apparatuses may increase luminous flux and provide optimal efficiency through novel arrangement of a plurality of light emitting blocks on a circuit board and a plurality of LEDs and drive ICs included in each of the light emitting blocks to be sequentially driven, and/or through efficient series-parallel connection between a limited number of LEDs.

Abstract: An optical semiconductor lighting apparatus includes: a housing; a heat discharge block which is made of a metal and is embedded in the housing; an AC direct-connection module which is made of a metal and is embedded in the housing, the AC direct-connection module including a semiconductor optical device which is driven in an AC direct-connection scheme; and an insulation connector which is provided in the AC direct-connection module and is exposed to an outside of the housing for electrical connection with an external power source.

Abstract: An optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube, and a plurality of optical semiconductor modules arranged along a circumference of the light-transmitting tube and separated from each other in a cross-sectional view of the light-transmitting tube. Each of the optical semiconductor modules is placed on a point, which is not on a central axis line of light emitted from other optical semiconductor modules, so as not to face another optical semiconductor module at an opposite side thereof.

Abstract: A light emitting module according to an exemplary embodiment of the present invention includes a printed circuit board (PCB) and first through m-th lighting blocks (‘m’ is an integer greater than one). The PCB has wiring patterns electrically connecting optical semiconductor devices. The first through the m-th lighting blocks are disposed on the PCB and configured to generate light. Each of the first through the m-th lighting blocks includes first through n-th lighting groups (each block includes at least one group), each of which includes optical semiconductor devices disposed on the PCB, and an electric currents configured to flow through each lighting group is substantially the same.

Abstract: An adjusting unit disposed between a housing including at least one or more semiconductor optical devices and a case accommodating an SMPS, so as to adjust the height of the casing. At least one or more light emitting modules are mounted on the bottom surface of the housing, and a position determining unit is disposed in the housing in correspondence to an edge of the light emitting module. A heat sink unit is provided in correspondence to the top surface of the housing. Therefore, transport costs can be significantly reduced by securing the loading space. The semiconductor optical devices serving as a light source can be appropriately arranged, and the semiconductor optical devices can be mounted at accurate positions. Furthermore, products can be rapidly mass-produced due to a simplified manufacturing process thereof.

Abstract: A optical semiconductor lighting apparatus includes: a board; a drive IC which is disposed in a central portion of the board; a plurality of semiconductor optical devices which is disposed adjacent to and around the drive IC in the board in a grid shape in one or more rows and columns; a non-insulating heat sink in which the board is disposed; an insulating housing which accommodates the heat sink and protects the drive IC and the plurality of semiconductor optical devices from withstand voltages; and a first optical member which faces the plurality of semiconductor optical devices, transmits or reflects light irradiated from the semiconductor optical devices, and forms a vertical vent hole corresponding to the drive IC; and a second optical member which is connected to an upper side of the housing and forms light distribution by refracting light transmitted or reflected from the first optical member.

Abstract: An optical semiconductor illuminating apparatus capable of being simply installed and built, easily detecting a fault generation point, being simply repaired and replaced, and being compactly implemented. A bracket assembly having a power supply embedded therein is mounted at an upper side of a heat sink including a fixed unit, the power supply is seated on the heat sink including the fixed unit, a plurality of heat radiation fins protrude from an inner surface of the heat sink, and an upper surface of the power supply is disposed at a position higher than or equal to that of an edge of an upper end portion of the heat sink.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer molded wavelength conversion layer disposed on at least one surface of the light-transmitting member. The transfer molded wavelength conversion layer includes a resin and a phosphor.

Abstract: An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.

Abstract: An optical semiconductor lighting apparatus includes a light emitting module including a semiconductor optical device, a housing to house the light emitting module, a first sealing body connected to a groove recessed in a polygonal or closed-curve shape of the housing, a first optical cover covering an outer edge of the groove and a top surface of the housing, a first rib formed on a top surface of the first sealing body along a forming direction of the first sealing body, and a pair of second ribs formed in parallel along both edges of a bottom surface of the first sealing body.