Abstract: An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of graphite suspended therein. In the preferred embodiment, the composition further includes a polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for transferring heat from a heat-dissipating component to a heat dissipater, which comprises applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.

Abstract: A thermal interface facilitates heat transfer from an electronic component to a heat sink. The thermal interface has a generally planar substrate formed of a heat resistant material having a layer of adhesive formed upon one surface thereof. A layer of conformable, heat conducting material is formed upon the other surface of the substrate. The other layer of adhesive facilitates attachment of the thermal interface to either an electronic component or a heat sink, as desired. The layer of conformable heat conducting material deforms so as to enhance heat transfer from the electronic component to the heat sink.