Abstract: The present invention provides a low-profile printed circuit board including a substrate having at least one planar magnetic element supported thereon. The element includes a planar winding integral with the conductive circuit formed on either one or the other side of the board, and electrical communication is made from one side of the board to the other side via plated through holes provided in the substrate. Additional planar windings may be surface mounted to the winding carried by the substrate. A dielectric coating is also provided which completely isolates the winding of the planar magnetic element.