Patents Assigned to POWER MASTER SEMICONDUCTOR CO., LTD.
  • Power module package
    Patent number: 11728317
    Abstract: A power module package is provided. The power module package may include: a first substrate; a second substrate; a semiconductor chip disposed between the first substrate and the second substrate; and a mutual-connection layer that is formed between the semiconductor chip and the second substrate and provides conductive connection between the semiconductor chip and the second substrate.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: August 15, 2023
    Assignee: POWER MASTER SEMICONDUCTOR CO., LTD.
    Inventors: In-Suk Kim, Ki-Myung Yoon
  • Semiconductor device
    Patent number: 11489042
    Abstract: A semiconductor device is provided.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: November 1, 2022
    Assignee: POWER MASTER SEMICONDUCTOR CO., LTD.
    Inventors: Jaegil Lee, Sangtae Han