Abstract: The present invention relates to polymer moldings with conductive, especially electrically conductive, structures on the surface, and to a process for production of these polymer moldings. A further aspect of the invention relates to the use of a device for production of the conductive, especially of the electrically conductive, structures on the surface of the polymer molding. The invention additionally relates to the use of an adhesive comprising carbon nanotubes (CNTs) for electrically conductive bonding of an electronic component to another electrically conductive component or molding. The invention additionally relates to a circuit board arrangement comprising at least one circuit board with at least one electrically conductive track. The at least one electrically conductive track preferably comprises a metal layer and/or at least one electronic component. The invention also relates to processes for production of the inventive circuit board arrangements.