Patents Assigned to Precision Mechatronics Pty Ltd
  • Publication number: 20130115729
    Abstract: Lithographic fabrication of a pressure sensor (30) for environments such as vehicle tires is described. The sensor has a first wafer substrate (32) with first and second planar surfaces on opposing sides. CMOS circuitry (34) is deposited on the first planar surface. A layer of passivation material is deposited on the circuitry. Etched openings in the passivation layer expose parts of the circuitry and an aperture is etched through the first wafer to fluidically connect the exposed circuitry with the second planar surface. Sacrificial material is deposited in the aperture and then a flexible membrane (50) is deposited on the sacrificial material and the exposed parts of the circuitry. The sacrificial material is subsequently etched from the aperture from the second surface. A second substrate is sealed to the second planar surface of the first wafer substrate to define a chamber (58) containing a fluid at a reference pressure.
    Type: Application
    Filed: October 24, 2012
    Publication date: May 9, 2013
    Applicant: Precision Mechatronics Pty Ltd
    Inventor: Precision Mechatronics Pty Ltd
  • Patent number: 8333456
    Abstract: A system for creating a three dimensional printed structure having a plurality of layers. The system includes a plurality of printheads arranged to print voxels of material so as to define respective layers of the structure, a robot for inserting objects into voids created in the structure during printing, and a conveyance for conveying a substrate past the printheads such that the printed structure is created on the substrate.
    Type: Grant
    Filed: January 17, 2010
    Date of Patent: December 18, 2012
    Assignee: Precision Mechatronics Pty Ltd
    Inventor: Kia Silverbrook