Abstract: A system for conditioning the leads of a semiconductor device. The system includes a base having anvil surfaces configured to form the leads to a predetermined shape, and forming arms mounted to the base. An actuator is movable relative to the base to move the forming arms from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration. Adjustment means adjust the position of said anvil and arms. A video scanner scans sample semiconductor devices and generates lead dimension and configuration signals. A processor processes said signals and applies the processed signals to the adjustment means to form leads of a semiconductor device to predetermined dimensions and configuration.

Abstract: A system for conditioning the leads of a semiconductor device. The system includes a base having at least one anvil surface configured to form the leads to a predetermined shape, and at least one forming arm mounted to the base. An actuator is movable relative to the base to move the forming arm from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration.

Abstract: An apparatus and method for conditioning the leads of a semiconductor device having parallel leads formed to a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus also includes a device for forming the leads to a partially unbent condition having at least one clamping arm pivotal between a first position spaced from the leads and a second position compressing a portion of the leads between the clamping arm and the support. The apparatus further includes a device for reforming the leads to a predetermined configuration.

Abstract: An apparatus and method for conditioning the leads of a semiconductor device having parallel leads projecting in a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus further includes a device for forming the leads to at least partially remove any bends in the leads, and a device for reforming the leads to a predetermined configuration. The lead conditioning method includes the steps of bringing the leads into parallelism, forming the leads to a partially unbent condition, and shaping the leads in a desired lead configuration.