Abstract: Wire for repairing or changing circuit elements such as printed circuits, has heat-resistant insulation surrounded by a hot-melt adhesive. The wire is attached to the surface of printed circuit boards easily by applying a hot iron to the adhesive layer on the wire and melting the adhesive which then adheres to the board surface. The coating is applied by passing insulated wire vertically through a length of molten adhesive and then through a die. Printed circuit board modifications can be made quickly and easily and at a relatively low cost.

Abstract: Wire for repairing or changing circuit elements such as printed circuits has heat-resistant insulation surrounded by a hot-melt adhesive. The wire is attached to the surfaces of printed circuit boards easily by applying a hot iron to the adhesive layer on the wire and melting the adhesive which then adheres to the board surface. The hot iron has a tip with a groove in it so that when the iron tip is pressed onto the wire, the tip embraces the wire to melt the adhesive quickly and to make the bond relatively quickly. The coating is applied by passing insulated wire vertically through a length of molten adhesive and then through a die. A cleaner/holder device is used for cleaning the tip of a hot iron used for melting adhesive, or a soldering iron, and for holding the hot iron when it is not in use. The preferred cleaner is anti-combustion treated absorbent cotton string wound on a spool which is mounted in the holder, or adhesive tape with a soft clutch backing.