Abstract: A method is provided for concurrently forming terminals on a multilayer capacitor having a first plurality of interior plates with edges that are brought to and exposed upon a first surface and a second plurality of interior plates, interleaved with the first plurality of interior plates, and spaced from the first plates by a dielectric. The second plurality of interior plates has edges that are brought to and exposed upon a second surface, which is not adjacent to the first surface. A first terminal is formed by plating a layer of electrically-conductive first metal directly onto the first surface including where the edges of the first plates are exposed upon the first surface and concurrently forming a second terminal by plating a layer of electrically-conductive first metal directly onto the second surface including where the edges of the second plates are exposed upon the second surface.