Abstract: A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.

Abstract: A structural unit having a frame, a connecting face that surrounds an opening and a cover that is attached to the connecting face to cover the opening. The frame and the cover are formed of materials with different coefficients of thermal expansion, and the connecting face has a channel that opens towards the cover. At least one duct communicates with the channel so that when a filling compound is injected into the duct it is received in the channel. The filling compound thereby attaches the cover to the frame and provides a seal therebetween.

Abstract: A constructional unit has a frame and a cover. The frame and the cover are formed of materials with different coefficients of thermal expansion. A plurality of spacers is arranged between the frame and the cover and defines a gap therebetween. An adhesive is provided in the gap to attach the frame to the cover and simultaneously seal the gap.