Patents Assigned to Prilit Optronics, Inc.
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Patent number: 11967601Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.Type: GrantFiled: August 13, 2021Date of Patent: April 23, 2024Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu, Chun-Bin Wen, Chien-Lin Lai, Hsing-Ying Lee
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Patent number: 11810499Abstract: A micro-light-emitting diode (microLED) display panel includes a display area divided into a plurality of blocks; a plurality of drivers that drive microLEDs of the blocks respectively; and at least one timing controller that controls the drivers. In each block, anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of microLEDs in a same column are connected to a corresponding common line.Type: GrantFiled: June 20, 2022Date of Patent: November 7, 2023Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Hsin-Hung Chen, Hsing-Ying Lee
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Patent number: 11670226Abstract: A micro-light-emitting diode (microLED) display panel includes a timing controller, and a plurality of drivers controlled by the timing controller and arranged in an order according to distance from the timing controller. Each driver includes a buffer that buffers a signal before being sent to a succeeding driver.Type: GrantFiled: April 11, 2022Date of Patent: June 6, 2023Assignees: Prilit Optronics, Inc., Himax Technologies LimitedInventors: Biing-Seng Wu, Tzung-Ren Wang, Hsin-Hung Chen
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Patent number: 11552127Abstract: A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.Type: GrantFiled: April 19, 2021Date of Patent: January 10, 2023Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu
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Patent number: 11508293Abstract: A display system includes a display panel that includes a plurality of micro-light-emitting diodes (microLEDs), the display panel being divided into a plurality of display blocks; and a plurality of drivers correspondingly driving the plurality of display blocks. Data signals of each driver are provided to a corresponding display block at different times within a horizontal scan period.Type: GrantFiled: October 6, 2021Date of Patent: November 22, 2022Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Tzung-Ren Wang
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Patent number: 11430738Abstract: A light-emitting diode display is provided. The light-emitting diode display includes a substrate, a plurality of wires, a plurality of light-emitting areas, and at least one driver IC. The plurality of wires are formed on the substrate. The plurality of light-emitting areas include a light-emitting diode area and a virtual area. The plurality of light-emitting areas are arranged in a matrix. The virtual area of the plurality of light-emitting areas corresponds to each other. The driver IC is formed on the virtual area of the plurality of the light-emitting areas or on the plurality of the light-emitting areas.Type: GrantFiled: December 24, 2018Date of Patent: August 30, 2022Assignee: PRILIT OPTRONICS, INC.Inventors: Biing-Seng Wu, Chao-Wen Wu
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Patent number: 11348845Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.Type: GrantFiled: September 1, 2020Date of Patent: May 31, 2022Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu
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Patent number: 11094862Abstract: A bonding method of a semiconductor device is disclosed. The method includes steps of forming a plurality of holes on two bonding parts of a main substrate, respectively; disposing a semiconductor device on the main substrate, and aligning the two bonding parts with two conduction parts of the semiconductor device; aligning a laser to the conduction parts and operating the laser to emit a laser beam from a lower part of the main substrate, wherein the laser beam passes through the holes of the bonding part to strike on the conduction part, so as to melt each conduction part to bond with the bonding part. With configuration of the holes, the conduction parts and the bonding part can be smoothly bonded by using laser, so as to achieve the purpose of transferring the semiconductor device.Type: GrantFiled: February 5, 2019Date of Patent: August 17, 2021Assignee: PRILIT OPTRONICS, INC.Inventors: Biing-Seng Wu, Chao-Wen Wu, Hsing-Ying Lee
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Support structure with sacrifice structure for light-emitting diode and manufacturing method thereof
Patent number: 11063180Abstract: A support structure for a light-emitting diode utilizes the configuration of a sacrifice structure to achieve safe separation of a light-emitting diode from a carrier substrate. Specifically, when an external force is applied on the light-emitting diode or the carrier substrate, a breaking layer of the sacrifice structure is the first layer to be broken, so that the light-emitting diode and carrier substrate will become separated from each other.Type: GrantFiled: June 14, 2019Date of Patent: July 13, 2021Assignee: PRILIT OPTRONICS, INC.Inventors: Biing-Seng Wu, Chao-Wen Wu, Chun-Jen Weng -
Patent number: 11011574Abstract: A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.Type: GrantFiled: December 30, 2019Date of Patent: May 18, 2021Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu
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Patent number: 10978332Abstract: A vacuum suction apparatus includes a semiconductor substrate with a top portion having grooves and a bottom portion having through holes, wherein each said groove correspondingly connects with at least one said through hole, and the groove has a width greater than a width of the through hole; and a cover plate disposed on a top surface of the semiconductor substrate. At least one edge of the vacuum suction apparatus has a vacuum chamber, which connects with the grooves. In another embodiment, the cover plate is replaced with a vacuum cover disposed above the semiconductor substrate, wherein the vacuum cover and the semiconductor substrate construct a vacuum chamber.Type: GrantFiled: September 26, 2017Date of Patent: April 13, 2021Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu, Tzung-Ren Wang
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Patent number: 10832978Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.Type: GrantFiled: February 18, 2020Date of Patent: November 10, 2020Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu
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Patent number: 10804134Abstract: A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.Type: GrantFiled: February 11, 2019Date of Patent: October 13, 2020Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chun-Jen Weng, Chao-Wen Wu
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Patent number: 10727095Abstract: A micro device transfer system includes a transfer head having pick-up electrodes for picking micro devices and thin-film transistors (TFTs) corresponding to the pick-up electrodes; a transfer head holder for holding the transfer head; a TFT driver board electrically connected to control the TFTs; a donor or acceptor substrate for carrying the micro devices; and a substrate holder for holding the donor or acceptor substrate.Type: GrantFiled: February 12, 2018Date of Patent: July 28, 2020Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu
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Patent number: 10699631Abstract: A LED sensing system and a display panel sensing system are disclosed. The LED sensing system comprises LEDs and a driver. The LEDs are arranged in a LED array, and the driver is disposed on a central portion of the LED array and electrically connected to the LEDs respectively. The driver can receive an activation maintenance signal, and receive an input address, and turn on one of the LEDs corresponding to the input address, so as to obtain a magnitude of a voltage of the LED corresponding to the input address for determining performance of the LED and a yield rate of the LED array.Type: GrantFiled: September 12, 2018Date of Patent: June 30, 2020Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Fa-Ming Chen
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Patent number: 10636710Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.Type: GrantFiled: May 7, 2019Date of Patent: April 28, 2020Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu
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Patent number: 10529701Abstract: A micro light-emitting diode (microLED) display panel includes microLEDs; a substrate for supporting the microLEDs, the substrate being divided into a plurality of sub-regions; and a plurality of chip-on-film (COF) packages mounted on surfaces of the sub-regions respectively, a plurality of drivers being disposed on the COF packages respectively.Type: GrantFiled: September 11, 2018Date of Patent: January 7, 2020Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Fa-Ming Chen, Shin-Hung Chen
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Patent number: 10356858Abstract: A microLED display panel includes a substrate being divided into a plurality of sub-regions for supporting microLEDs, and a plurality of drivers being correspondingly disposed on surfaces of the sub-regions respectively. The driver includes a low-dropout (LDO) regulator and a drive circuit. The LDO regulator receives a system power, according to which a regulated power is generated and provided for the drive circuit.Type: GrantFiled: September 13, 2017Date of Patent: July 16, 2019Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Fa-Ming Chen
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Patent number: 10290255Abstract: A data driver of a microLED display includes clock generators that generate pulse width modulation (PWM) clocks of corresponding primary colors respectively; counters that receive the PWM clocks of corresponding primary colors respectively and accordingly generate corresponding PWM signals; and comparators associated with corresponding data channels respectively for comparing a held data signal with the corresponding PWM signal, thereby generating a comparison result signal. In one embodiment, the data driver further includes switches configured to electrically short output nodes of channel amplifiers of corresponding primary colors respectively for testing uniformity of microLEDs of one color.Type: GrantFiled: September 19, 2017Date of Patent: May 14, 2019Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Fa-Ming Chen
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Patent number: 10199362Abstract: A microLED display panel includes a substrate being divided into a plurality of sub-regions for supporting microLEDs, and a plurality of drivers being correspondingly disposed on surfaces of the sub-regions respectively. In one embodiment, a top surface of the substrate has a recess for accommodating the driver.Type: GrantFiled: January 15, 2018Date of Patent: February 5, 2019Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu