Abstract: A micro-light-emitting diode (microLED) display panel includes a plurality of microLEDs arranged in rows and columns. Anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of pixels in a same column are connected to a corresponding group of common lines, each of which is connected to cathodes of microLEDs of different colors.

Abstract: A foldable micro-light-emitting diode (microLED) display includes a flexible supporting film, a plurality of drivers and a plurality of display panels attached to the supporting film. Each display panel includes a plurality of blocks each having a plurality of microLEDs controlled by a corresponding driver.

Abstract: A driving circuit adaptable to a display panel includes a driving transistor connected between a first supply voltage and a light-emitting diode (LED); and two capacitors controllably connected to the driving transistor and a corresponding data line that provides an image signal. One of the two capacitors is used as a driving capacitor to controllably drive the driving transistor with a present image signal, while another of the two capacitors is used as a pre-loading capacitor for controllably pre-loading a succeeding image signal therein.

Abstract: A light-emitting diode (LED) display includes a top-emission LED that emits light upward; a bottom-emission LED that emits light downward; and a spacer disposed between the top-emission LED and the bottom-emission LED, thereby providing a dual-sided display.

Abstract: A micro-light-emitting diode (microLED) display panel includes microLEDs disposed on a display area, which is divided into a plurality of blocks; drivers respectively disposed on the blocks; and probe pads disposed within each block, the probe pads being electrically connected to corresponding microLEDs via corresponding electric wires. The probe pads and the electric wires of a corresponding block are disposed locally and confined to the corresponding block, and are not connected elsewhere beyond the corresponding block.

Abstract: A transfer system adaptable to performing levelling alignment includes a transfer head that picks up micro devices, the transfer head having a plurality of pick-up heads protruded from a bottom surface of the transfer head; and a levelling fixture configured to perform levelling alignment for the transfer head, the levelling fixture having a plurality of cavities that are concave downwards to correspondingly accommodate the pick-up heads respectively.

Abstract: A micro-light-emitting diode (microLED) display panel includes a substrate; a plurality of microLEDs disposed and arranged in rows and columns on the substrate; a driver disposed on the substrate; a plurality of first blocking walls respectively disposed between rows of the microLEDs; and a plurality of second blocking walls respectively disposed between the microLEDs of the same row.

Abstract: A micro-light-emitting diode (microLED) display panel includes a substrate and a driver bonded on the substrate. The driver includes a signal terminal coupled with a signal wire disposed on the substrate; and a repair terminal associated with the signal terminal, the repair terminal coupled with a repair wire disposed on the substrate.

Abstract: A mixed reality display system includes a transparent display, through which users on both sides see each other; a plural pairs of shutter glasses worn by the users, each pair of shutter glasses being composed of a left glass and a right glass; and a controller that synchronizes the transparent display and the shutter glasses.

Abstract: A pulse-width modulation (PWM) circuit includes a partition circuit coupled to receive a PWM value representing a duty cycle of a PWM signal to be generated, and configured to accordingly generate a most-significant-bits (MSB) value representing higher-order bits of the PWM value and a least-significant-bits (LSB) value representing lower-order bits of the PWM value; a PWM generator coupled to receive the MSB value or a derivative thereof, and configured to accordingly generate a primary signal with a duty cycle corresponding to the MSB value; a delay circuit that generates a delay signal representing the primary signal with delay time determined according to the LSB value or a derivative thereof; and a combine circuit that generates the PWM signal according to the primary signal and the delay signal, by performing a logical operation on the primary signal and the delay signal.

Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

Abstract: A micro-light-emitting diode (microLED) display panel includes a display area divided into a plurality of blocks; a plurality of drivers that drive microLEDs of the blocks respectively; and at least one timing controller that controls the drivers. In each block, anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of microLEDs in a same column are connected to a corresponding common line.

Abstract: A micro-light-emitting diode (microLED) display panel includes a timing controller, and a plurality of drivers controlled by the timing controller and arranged in an order according to distance from the timing controller. Each driver includes a buffer that buffers a signal before being sent to a succeeding driver.

Abstract: A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

Abstract: A display system includes a display panel that includes a plurality of micro-light-emitting diodes (microLEDs), the display panel being divided into a plurality of display blocks; and a plurality of drivers correspondingly driving the plurality of display blocks. Data signals of each driver are provided to a corresponding display block at different times within a horizontal scan period.

Abstract: A light-emitting diode display is provided. The light-emitting diode display includes a substrate, a plurality of wires, a plurality of light-emitting areas, and at least one driver IC. The plurality of wires are formed on the substrate. The plurality of light-emitting areas include a light-emitting diode area and a virtual area. The plurality of light-emitting areas are arranged in a matrix. The virtual area of the plurality of light-emitting areas corresponds to each other. The driver IC is formed on the virtual area of the plurality of the light-emitting areas or on the plurality of the light-emitting areas.

Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.

Abstract: A bonding method of a semiconductor device is disclosed. The method includes steps of forming a plurality of holes on two bonding parts of a main substrate, respectively; disposing a semiconductor device on the main substrate, and aligning the two bonding parts with two conduction parts of the semiconductor device; aligning a laser to the conduction parts and operating the laser to emit a laser beam from a lower part of the main substrate, wherein the laser beam passes through the holes of the bonding part to strike on the conduction part, so as to melt each conduction part to bond with the bonding part. With configuration of the holes, the conduction parts and the bonding part can be smoothly bonded by using laser, so as to achieve the purpose of transferring the semiconductor device.

Abstract: A support structure for a light-emitting diode utilizes the configuration of a sacrifice structure to achieve safe separation of a light-emitting diode from a carrier substrate. Specifically, when an external force is applied on the light-emitting diode or the carrier substrate, a breaking layer of the sacrifice structure is the first layer to be broken, so that the light-emitting diode and carrier substrate will become separated from each other.

Abstract: A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.