Abstract: A radiofrequency transceiver device comprises an electronic circuit including a chip and a first antenna electrically connected to the chip, a textile-core thread formed of a non-conductive material, and a second antenna formed of a textile element in an electrically conducting material and disposed in non-contiguous turns around and along the textile-core thread. The electronic circuit is disposed relative to the second antenna so as to allow the electromagnetic coupling of the first and second antenna. A label may comprise the radiofrequency transceiver device. A particular method may be used to manufacture such a device.

Abstract: A method for making a textile part, comprising a step of forming a stitched seam. The stitched seam step also aims to secure an electronic tag to the textile part. The electronic tag is formed from a strip comprising a wired electronic device comprising a chip associated with at least one antenna wire, the chip and the antenna wire being arranged inside the stitched seam. The invention also relates to the textile part provided with the tag.

Abstract: A system for inserting a wire into a semiconductor chip system includes positioning members for deploying and moving a length of the wire between a first end and a second end of a workspace. A handling device of the system is configured to handle the semiconductor chip, and is capable of placing the chip in an insertion position in which a groove of the chip is placed opposite the wire. A positioning member of the system is configured to arrange a longitudinal section of the wire along the groove, in forced abutment against a pad of the chip made of a bonding material having a melting point. A heating member of the system is configured to heat a zone comprising the pad to a processing temperature above the melting point to melt the pad and provoke insertion of the wire into the groove.

Abstract: A radiofrequency transmission/reception device includes a first and a second conductive wire element, a first far-field transmission/reception chip and a second near-field transmission/reception chip. The first and the second wire element combine with the characteristic impedance of the second transmission/reception chip in order to form a coupling device associated with the first transmission/reception chip at the operating frequency of the first chip. The first and the second wire element combine with the characteristic impedance of the first transmission/reception chip in order to form a coupling device associated with the second transmission/reception chip at the operating frequency of the second chip.

Abstract: A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.

Abstract: A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.

Abstract: A method for joining a microelectronic chip to at least one wire element comprises: a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove; a step of inserting the wire element into the temporary groove; a step of attaching the wire element to the microelectronic chip; and a step of removing the cover from the microelectronic chip.