Abstract: The invention relates to a method for pattern recognition to assemble printed circuit boards by digital printing and a system for implementing the method. In the method, pattern recognition techniques are applied to extract information from imaging of the printed circuit board, thereby enabling automated printing of a targeted object on the board. The method comprises digital printing of a material that is uniformly coated on a transparent donor substrate and positioned in parallel to a receiver substrate. A laser pulse irradiates the donor substrate, resulting in detachment and transfer of a portion of the material onto the receiver substrate. The method enables reduction of overall processing time while achieving high alignment accuracy and high printing resolution.