Abstract: A method of making a probe ring including the steps of providing a substrate, forming the maximum number of traces possible on the substrate, forming the appropriate number of pads on the substrate using the pad mask for making electrical contacts for the semiconductor device, forming appropriate lines of electrical connection between the traces and the pads, and plating the pads to a height to provide adequate clearance between the substrate and the semiconductor device.Additionally disclosed is a method of making a fixed point probe apparatus including providing a probe card having an opening sized and shaped for mating with the probe ring and inserting the ring in the opening.