Abstract: Various embodiments are directed at an apparatus for implementing electrical connectivity for testing of a semiconductor device. The apparatus comprises a probe head which comprises an upper guide plate and a lower guide plate, wherein the upper guide plate defines a plurality of first apertures, and the lower guide plate defines a plurality of second apertures in some embodiments. The apparatus further comprises a plurality of probes, wherein each of the plurality of probes passes through one of the plurality of first apertures on the upper guide plate and one of the plurality of second apertures on the lower guide plate, and at least one of the plurality of probes defines a buckled form after the at least one of the plurality of probes is finally assembled in the apparatus. The apparatus further comprises a template member to guide the plurality of probes.

Abstract: Disclosed is an improved probe having a spring portion which allows effective contact with a device under test without requiring a lower die portion. The probe includes a slot retention and placement portion, which provides for an improved approach for manufacturing arrangements of probes, where the slot retention and placement portions of the probe facilitate precise placement and alignment of the probes while not excessively increasing the cost or complexity of the probes and probe cards.