Abstract: A method and apparatus for probing with backside emission microscopy for locating defect sites in an integrated circuit specimen, where a first microscope positioned for observing the front side of the specimen and a second microscope positioned for observing the backside of the specimen. A carrier is provided for supporting the specimen in a plane perpendicular to the plane of the first and second microscopes. A white light camera is mounted on the first microscope for acquiring an illuminated image of the front side of the specimen, and generates its image as corresponding to site indicia of the backside of the specimen. A light emission sensitive camera mounted on the second microscope acquires a light emission image of the backside of the specimen in response to electrical test signals applied at terminals of the specimen by test probes. The light emission sensitive camera generates the emission image for superposing with the illuminated image to identify the location of defect sites in the specimen.