Patents Assigned to Process Automation International Limited
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Patent number: 6632011Abstract: A mixing apparatus 1 comprising a chamber 12 with at least one inlet 16 allowing entry of a solute and a liquid solvent, at least one outlet 52 allowing exit of a solution of said solute and solution, and at least a separator 22 having at least one generally upwardly facing surface 40 and one generally downwardly facing surface 38a, wherein said surfaces define a passageway 50 allowing the solution of the solute and the solvent to pass through and out of the chamber 12, and wherein undissolved solute is descendable along the generally upwardly facing surface 40a.Type: GrantFiled: June 23, 2000Date of Patent: October 14, 2003Assignee: Process Automation International LimitedInventors: Paul Henington, Kwok Wai Wen
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Patent number: 6439758Abstract: An apparatus 20 for mixing a solute with a solvent is described. The apparatus 20 includes a mixing chamber 12 for a solute and solvent and in which the solute and solvent are moved via a pump 18 and tubes (68a, 68b, 68c and 70). The chamber 12 also contains a divider 80 which, when occupying a first position (“U”), substantially divides the chamber 12 into at least two portions.Type: GrantFiled: June 23, 2000Date of Patent: August 27, 2002Assignee: Process Automation International LimitedInventors: Paul Henington, Kwok Wai Wen
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Patent number: 6274010Abstract: An apparatus for electroplating at least one substrate is disclosed as including a trough, two anodes, at least one bath and two poly-tetrafluoroethylene sheets or a number of substantially rigid polypropylene plates, in which the trough supports the substrate and is in an electrically conductive relationship therewith, and the bath contains the anodes, the trough and an electrolyte, in which, in operation, an electric field exists in the electrolyte between the trough and the anodes, and in which the poly-tetrafluoroethylene sheets or the polypropylene plates are movable to vary the amount of electric current passing between the trough and the anodes.Type: GrantFiled: July 13, 1998Date of Patent: August 14, 2001Assignee: Process Automation International LimitedInventors: Paul Henington, Chun Pan Fung, Kwok Wah Li, Chi Chung Lee
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Patent number: 5589051Abstract: A clamp for use in an electrolytic plating bath is disclosed. The clamp comprises two levers pivotally attached to each other at a fulcrum wherein the clamp, when floating on top of a liquid, is in an open position but when submerged is caused, by virtue of its buoyancy, to move to a closed position. Each lever comprises a first part integrally attached to a second part. The first part and the second part are situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position. In operation, at least one substrate is supported in a substantially vertical plane for submersion into an electrolyte bath. The substrate is positioned over the electrolyte bath and then is submersed into it. The clamp clamps the substrate at its lower edge as the substrate enters the electrolyte bath.Type: GrantFiled: December 9, 1994Date of Patent: December 31, 1996Assignee: Process Automation International LimitedInventor: Paul Henington
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Patent number: RE37050Abstract: A clamp for use in an electrolytic plating bath is disclosed. The clamp comprises two levers at least two opposing levers, at least one lever being pivotally attached to each other at a fulcrum wherein the clamp, when floating on top of a liquid, is in an open position but when submerged is caused, by virtue of its buoyancy, to move to a closed position. Each lever comprises a first part integrally attached to a second part. The first part and the second part are situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position. In operation, at least one substrate is supported in a substantially vertical plane for submersion into an electrolyte bath. The substrate is positioned over the electrolyte bath and then is submersed into it. The clamp clamps the substrate at its lower edge as the substrate enters the electrolyte bath.Type: GrantFiled: December 30, 1998Date of Patent: February 13, 2001Assignee: Process Automation International LimitedInventor: Paul Hennington