Abstract: An improved child resistant blister package for medicaments in pill form includes a blister sheet having a pattern of blisters formed therein for receiving individual pills and a rupturable lidding foil laminated to the blister sheet covering and sealing the blisters. A reinforcing card having a corresponding pattern of punch-outs formed therein by weakened score lines is laminated to the lidding foil with a punch-out overlying each blister, and a reinforcing film of high strength flexible material is laminated to the card using a low peel adhesive. The reinforcing film covers the punch-outs and an area of the card surrounding each punch-out, and has weakening score lines formed therein separating the areas overlying each punch-out to enable the reinforcing film to be peeled from the portion of the package overlying the individual punch-outs without disturbing the portion overlying the remaining punch-outs.