Abstract: Apparatus for inserting a semiconductor wafer in a slot of a holding post including a wafer support member or paddle for supporting the wafer and inserting it into a slot and rotation device for rotating the support member by the angle necessary to cause edges of the wafer to be received at the centers of the slots.

Abstract: Apparatus for storing articles including walls defining a bin enclosure having an opening for transporting articles therethrough, a support for supporting articles in an article storage region in the enclosure, and a source of pressurized particle-free air to the region to provide a higher pressure in the article storage region than outside of the enclosure. Also disclosed are an energy beam vision system that is carried by a transport system and interfaces with the walls and a controller that controls the transport mechanism in order to properly align the relative positions of the transport mechanism and the enclosure.

Abstract: Apparatus for placing a first element at a location on a second element, there being associated with the location some known variation in the shape of the second element, the apparatus including a support member for supporting the first element while the member is translated toward the second element along a placement direction, a transporter for moving the support member or the second element along a transport direction transverse to the placement direction, a sensor for sensing the relative alignment of the support member with the known variation in shape along the transport direction, the sensor including a scanning element that is detachably engageable by the support member, and a holder for storing the scanning element when the scanning element is not in use.

Abstract: Wafer transfer apparatus including a wafer-pickup element having suction openings closer to the edge of wafer than the wafer's center so that the wafer can be picked up with greater certainty as to the locations of the wafer edges, the openings being surrounded by raised portions so that the region of the wafer-pickup element between the opening is at a lower elevation than the raised portions so as to facilitate picking up warped wafers.

Abstract: Apparatus for aligning an object having a distinguishing feature in it, the apparatus including rotator means for holding and rotating the object about a rotation axis so that a portion of the surface including the distinguishing feature travels through a surface sensing region, engagement means for engaging the object and transferring it to and receiving it from the rotator means, sensing means for measuring and recording, during rotation of the object, position versus angular orientation information relating to position of the surface along an axis transverse to the surface, calculating means, responsive to the sensing means, for calculating from the position versus angular orientation information both the angular orientation of the distinguishing feature and the location of the center of the object with respect to the rotation axis, and alignment correction means for generating angular correction signals for rotating the object such that the distinguishing feature attains a predetermined angular orientatio

Abstract: Apparatus for transporting flat objects having first and second faces between a first carrier and a second carrier, the apparatus comprising a mechanism for supporting the first and second carriers, a pickup mechanism for picking up the objects and transporting the objects between the first carrier and the second carrier, and intermediate station having a mechanism for receiving the objects from the pickup mechanism with the faces in a first orientation and for changing the orientation of the faces before the objects are removed by the pickup mechanism.

Abstract: Circuitry for providing timing signals spaced in time by a varying amount, the circuitry including calculating means for repetitively performing a calculation to repetitively provide calculation signals the value (SUM) of which varies as a function of the number of times the calculation has been repeated, and timing signal generating means for receiving the calculation signals and providing a series of timing signals spaced in time by varying amounts, a timing signal being generated each time the value (SUM) has changed by a set amount (ACC).

Abstract: Wafer transfer apparatus including a wafer-pickup element having suction openings closer to the edge of wafer than the wafer's center so that the wafer can be picked up with greater certainty as to the locations of the wafer edges, the pickup element being thin and made of a structural layer of rigid structural material having grooves and a TEFLON layer laminated to the structural layer and having suction openings, the grooves and covering portions of TEFLON defining vacuum passages.

Abstract: Rolling apparatus comprising a support member, first bearing means connected to the support member for rotating relative to the support member, and a first tire of material softer than the bearing means mounted on the circumference of the bearing means, the tire having a circumference that increases from a smaller diameter side to a larger diameter side and a lip extending radially inward over a portion of the bearing means on the larger diameter side of the tire, whereby the lip is biased against the bearing means as the tire travels, and is prevented from moving off the bearing means at either side.

Abstract: Apparatus for placing a first element at a receptacle location on a second element, there being associated with the precise receptacle location some known variation in the shape of the second element, the apparatus comprising a support member for supporting the first element while the member is translated toward the second element along a placement direction, a first transport device for moving the support member or the second element along a direction transverse to the placement direction, and a sensing device located on the support member for sensing the relative alignment along the transverse direction of the support member and the variation in shape, the sensing device comprising an energy-beam source adapted and positioned to direct an energy beam along a path that interacts with the variation in shape at least when the support member and receptacle location are aligned so that more of the beam is transmitted along the path when the member and receptacle location are aligned than when the member and rece