Abstract: An apparatus for rapid thermal processing is described and includes a cylindrical lamp array structure (13) surrounding a cylindrical process tube (16). The cylindrical process tube (16) has a lengthwise central axis (22). The cylindrical lamp array structure (13) includes heat sources or lamps (26). The lamps (26) are positioned with respect to the cylindrical process tube (16) so that the sides of the lamps (26) focus light energy in the direction of the lengthwise central axis (22). Substrates (12) are oriented within the cylindrical process tube (16) so that the major surfaces (14) of the substrates (12) are substantially normal to the lengthwise central axis (22). In an alternative embodiment, a magnetic field source (19) is included for processing storage devices such as non-volatile memory devices.

Abstract: In one embodiment, a polishing apparatus (10) includes a retaining ring (12), a pressure ring (16), a first seal (18), and a second seal (20). The retaining ring (12) is movably attached to the pressure ring (16) to create a uniform pressure distribution across the retaining ring (12). In addition a positive fluid pressure is applied to the first seal (18) and the second seal (20) to create the uniform pressure distribution across the retaining ring (12). The uniform pressure distribution across the retaining ring (16) allows a semiconductor substrate (51), polished with the polishing apparatus (10), to have a reduced edge exclusion, and thus increased die yield.