Abstract: The disclosed system includes a two-phase cooling apparatus configured for cooling an array of LED dies.

Abstract: System, method, and apparatus for two phase cooling in light-emitting devices are disclosed. In one aspect of the present disclosure, an apparatus includes a light-emitting device and a two-phase cooling apparatus coupled to the light-emitting device. The coupling of the two-phase cooling apparatus and the light-emitting device is operatively configured such that thermal coupling between the light-emitting device and the two-phase cooling apparatus enables, when, in operation, heat generated from the light-emitting device to be absorbed by a substance of a first phase in the two-phase cooling apparatus to convert the substance to a second phase.

Abstract: The disclosed system includes a two-phase cooling apparatus configured for cooling an array of LED dies.

Abstract: Bonds and method for forming bonds for a two-phase cooling apparatus are disclosed. In one aspect of the present disclosure, the two-phase cooling apparatus includes an evaporator. One embodiment of the evaporator includes, a first layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the first layer, a cap structure formed such that when disposed over the first layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow, a bonding layer formed between the first layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer, the bonding layer comprising a bond.

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: System, method, and apparatus for two phase cooling in light-emitting devices are disclosed. In one aspect of the present disclosure, an apparatus includes a light-emitting device and a two-phase cooling apparatus coupled to the light-emitting device. The coupling of the two-phase cooling apparatus and the light-emitting device is operatively configured such that thermal coupling between the light-emitting device and the two-phase cooling apparatus enables, when, in operation, heat generated from the light-emitting device to be absorbed by a substance of a first phase in the two-phase cooling apparatus to convert the substance to a second phase.