Patents Assigned to Promex Industries, Inc.
  • Process for placing, securing and interconnecting electronic components
    Publication number: 20160073512
    Abstract: A method for fabricating an electronic assembly which enables the assembly and interconnection of surface mount components and/or other electrical, electronic, electro-optical, electro-mechanical and user interface devices with external I/O contacts on a planar surface without the use of solder or otherwise exposing the components to temperatures substantially above ambient.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 10, 2016
    Applicant: Promex Industries, Inc.
    Inventors: Edward Binkley, Robert Cattaneo, Hiep Nghi, George Laurie, Richard Otte