Abstract: A co-fired multi-layer stack chip resistor is provided. The co-fired multi-layer stack chip resistor includes a ceramic substrate and a multi-layer stack resistance structure monomer. The ceramic substrate is formed by stacking multiple layers of the ceramic membranes, wherein the ceramic membranes is formed of a bearing membrane and a porcelain slurry with the solvent, the binder and the dispersant. The multi-layer stack resistance structure monomer is stacked on the ceramic substrate, and includes multiple bearing membranes and multiple resistive layers, wherein each resistive layer is formed on the surface of the corresponding bearing membrane, the resistive layers are parallel to each other, and the contiguous resistive layers are stacked with the interval of the predetermined distance along the vertical direction.
Type:
Grant
Filed:
June 21, 2012
Date of Patent:
May 28, 2013
Assignee:
Prosperity Dielectrics Co., Ltd.
Inventors:
Yung Cheng Tsai, Ching Jen Tsai, Tung Yi Chou, Hung Chun Wu
Abstract: A co-fired multi-layer stack chip resistor is provided. The co-fired multi-layer stack chip resistor includes a ceramic substrate and a multi-layer stack resistance structure monomer. The ceramic substrate is formed by stacking multiple layers of the ceramic membranes, wherein the ceramic membranes is formed of a bearing membrane and a porcelain slurry with the solvent, the binder and the dispersant. The multi-layer stack resistance structure monomer is stacked on the ceramic substrate, and includes multiple bearing membranes and multiple resistive layers, wherein each resistive layer is formed on the surface of the corresponding bearing membrane, the resistive layers are parallel to each other, and the contiguous resistive layers are stacked with the interval of the predetermined distance along the vertical direction.
Type:
Application
Filed:
June 21, 2012
Publication date:
May 23, 2013
Applicant:
PROSPERITY DIELECTRICS CO., LTD.
Inventors:
YUNG CHENG TSAI, CHING JEN TSAI, TUNG YI CHOU, HUNG CHUN WU
Abstract: The present invention provides a surface mount design (SMD) coupling filter device with a fixed coupling coefficient having a pair of hollow coils. Theoretically, coupling coefficients of two hollow coils may vary with the parameter such as distance, number of windings, inner radius, wire size, medium coefficient. When a desired coil coupling distance is derived from the above parameters, a pair of hollow coils then is fastened fixed by either a house fastening approach or an adhesive injection fastening approach, such that the desired coil coupling distance can be fixed by using an adhesive with a specific medium coefficient.
Abstract: A wire-winding common mode choke has a body, a first coil and a second coil. The body has two channels respectively defined in two lateral sides of the body and at least two steps. Each step has a first folding end and a second folding end. The first and second coils are wired around the channels of the body and respectively across the first or second folding ends of the corresponding steps. When the first and the second coils are respectively weld by heating, there is no short circuit between the first and the second coils because the steps separate the first and second coils.