Abstract: Provided is a method of mounting bonding material deposits, a method of mounting bonding material deposits in mounting recesses formed in a mask so that the bonding material deposits may be mounted on an electrode of a substrate. According to the method of mounting the bonding material deposits, an area of the region where the bonding material deposits are concentrated in the chamber is increased, and thus, small and light-weight conductive balls may be effectively mounted in the mounting recesses of the mask. Also, according to the method of mounting the bonding material deposits, because chances that the bonding material deposits come into contact with the mounting recesses in the mask increase, the bonding material deposits may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

Abstract: Provided is a multi-nozzle pump for dispensing a viscous liquid, and in particular, to a multi-nozzle pump for dispensing a viscous liquid, which dispenses the viscous liquid through a plurality of nozzles with high resolution. The multi-nozzle pump for dispensing the viscous liquid has advantages of miniaturizing intervals between the nozzles and a total size of the pump while simultaneously or individually dispensing the viscous liquid through the plurality of nozzles. Also, according to the multi-nozzle pump for dispensing the viscous liquid, the intervals between the plurality of nozzles may be formed to be narrow as compared with the entire size and the pressing force, and thus, the viscous liquid of high viscosity may be dispensed with high resolution.

Abstract: According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

Abstract: Provided is a coupler supporting module configured to support a coupler for a drum container that stores various types of liquid, the coupler being connected to the drum container to enable liquid flow, and more particularly, a coupler supporting module for a drum container, which supports the coupler to tilt according to an angle of a discharge port of the drum container. The coupler supporting module for a drum container allows the coupler to be inserted into the discharge port of the drum container while tilting the coupler to align with an angle the discharge port when the coupler is lowered, by supporting the coupler in a tiltable manner using a tilting joint. Accordingly, the coupler supporting module for a drum container is applicable to an automated device that automatically connects the coupler to the drum container and is effectively utilized.

Abstract: A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

Abstract: Provided is a flip-chip laser bonding system for bonding a semiconductor chip in the form of a flip chip to a substrate using a laser beam. In the flip-chip laser bonding system, the semiconductor chip is laser-bonded to the substrate while pressure is applied to the semiconductor chip. Accordingly, even a semiconductor chip that is bent or is capable of being bent can be bonded to a semiconductor chip without contact failure.

Abstract: Provided is a conductive ball mounting method using an electrostatic chuck. According to the conductive ball mounting method using an electrostatic chuck, when the process of mounting conductive balls onto a substrate through mounting grooves formed in the mask is performed, the occurrence of process defects can be prevented and conductive balls having very small sizes can be effectively mounted on the substrate. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting conductive balls can be performed with high quality by preventing deformation of the mask without missing of some of the conductive balls. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting small sizes of conductive balls on the substrate can be effectively performed.

Abstract: Provided is an apparatus for ejecting viscous liquid aerosol, and more particularly, an apparatus for ejecting viscous liquid aerosol capable of dispensing a viscous liquid to a work with a fine line width by ejecting the viscous liquid in the form of aerosols. The apparatus for ejecting viscous liquid aerosol may be configured compactly by miniaturizing a device capable of aerosolizing and ejecting viscous liquid in the form of aerosols. In addition, since the apparatus for ejecting viscous liquid aerosol has a structure that is easy to miniaturize, it is easy to uniformly maintain the characteristics of aerosol.

Abstract: Provided is a progressive cavity pump. The progressive cavity pump operates such that a viscous liquid is discharged by rotating an eccentric rotor with respect to a stator. The progressive cavity pump may be easily disassembled for repair and maintenance, and may be easily attached to an accurate position during re-assembly. Also, in the progressive cavity pump, main components such as a nozzle, a rotor, a stator, etc. may be easily replaced so as to easily adjust dispensing characteristic, while the driving units such as a motor and a rotary shaft are installed in a dispenser, and thus, an idle time of the dispenser may be reduced.

Abstract: The present disclosure relates to a method of bonding column type deposits to a substrate, and more specifically, to a method of bonding to a substrate column type deposits, which are formed in a column shape and connect the substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. A method of bonding column type deposits to a substrate according to the present disclosure has the advantage of bonding the column type deposits having a high aspect ratio to accurate positions while being aligned vertically on the substrate.

Abstract: A low hysteresis piezo-electric pump using a piezo-electric element as an actuator to dispense a liquid may maintain accurate viscous liquid discharge characteristics by adjusting an applied voltage in response to changes in behavioral characteristics of a piezo-electric actuator depending on causes such as temperature change.

Abstract: Provided is a method of bonding column type deposits, and more specifically, a method of bonding, to a substrate, column type deposits which are formed in a column shape and connect a substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. The method of bonding the column type deposits to the substrate enables bonding the column type deposits having a high aspect ratio to accurate positions while being kept aligned vertically on the substrate.

Abstract: Provided is a dispensing apparatus capable of cleaning a nozzle, and more particularly, to a dispensing apparatus capable of cleaning a nozzle having the function of cleaning a nozzle of an apparatus for dispensing a viscous solution with a cleaning solution. The dispensing apparatus capable of cleaning a nozzle can effectively supply and manage a cleaning solution while effectively cleaning the viscous solution that are likely to be attached to the nozzle.

Abstract: A flip-chip laser bonding apparatus and method are provided in which flip-chip type semiconductor chips are bonded to a substrate using laser light. The flip-chip laser bonding apparatus and method are effective in rapidly bonding bent or flexible flip-chip type semiconductor chips to a substrate with high quality without contact defects of solder bumps.

Abstract: Provided is a progressive cavity pump. The progressive cavity pump operates such that a viscous liquid is discharged by rotating an eccentric rotor with respect to a stator. The progressive cavity pump may be easily disassembled for repair and maintenance, and may be easily attached to an accurate position during re-assembly. Also, in the progressive cavity pump, main components such as a nozzle, a rotor, a stator, etc. may be easily replaced so as to easily adjust dispensing characteristic, while the driving units such as a motor and a rotary shaft are installed in a dispenser, and thus, an idle time of the dispenser may be reduced.

Abstract: Provided is a diaphragm pump. The diaphragm pump operates such that a viscous liquid is discharged by transferring a pressing force via a diaphragm that is elastically deformed. The diaphragm pump has a structure capable of rapidly and accurately discharging the viscous liquid of high viscosity by using a diaphragm. Also, the diaphragm pump is capable of effectively pressing the viscous liquid while preventing the damage to the particles contained in the viscous liquid, by preventing the mechanical structure pressing the viscous liquid from coming into direct contact with the viscous liquid.

Abstract: According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

Abstract: Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.

Abstract: Provided is a hybrid spray pump which sprays and applies a viscous liquid in a fine particle state to a material. The hybrid spray pump sprays effectively fine particles of the viscous liquid according to various characteristics of the viscous liquid ranging from low to high viscosity, and improves the quality of a particle application process by mixing fine particles and aerosol particles by spraying.

Abstract: A low hysteresis piezo-electric pump using a piezo-electric element as an actuator to dispense a liquid may maintain accurate viscous liquid discharge characteristics by adjusting an applied voltage in response to changes in behavioral characteristics of a piezo-electric actuator depending on causes such as temperature change.