Abstract: Provided is a diaphragm pump. The diaphragm pump operates such that a viscous liquid is discharged by transferring a pressing force via a diaphragm that is elastically deformed. The diaphragm pump has a structure capable of rapidly and accurately discharging the viscous liquid of high viscosity by using a diaphragm. Also, the diaphragm pump is capable of effectively pressing the viscous liquid while preventing the damage to the particles contained in the viscous liquid, by preventing the mechanical structure pressing the viscous liquid from coming into direct contact with the viscous liquid.

Abstract: Provided is a progressive cavity pump. The progressive cavity pump operates such that a viscous liquid is discharged by rotating an eccentric rotor with respect to a stator. The progressive cavity pump may be easily disassembled for repair and maintenance, and may be easily attached to an accurate position during re-assembly. Also, in the progressive cavity pump, main components such as a nozzle, a rotor, a stator, etc. may be easily replaced so as to easily adjust dispensing characteristic, while the driving units such as a motor and a rotary shaft are installed in a dispenser, and thus, an idle time of the dispenser may be reduced.

Abstract: According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

Abstract: Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.

Abstract: Provided is a hybrid spray pump which sprays and applies a viscous liquid in a fine particle state to a material. The hybrid spray pump sprays effectively fine particles of the viscous liquid according to various characteristics of the viscous liquid ranging from low to high viscosity, and improves the quality of a particle application process by mixing fine particles and aerosol particles by spraying.

Abstract: A spray pump formed to atomize and apply a viscous liquid may micro-discharge the viscous liquid ranging from low to high viscosity in a quantitative manner, may miniaturize a device capable of atomizing liquids by spraying, and may shorten a spraying path to prevent changes in liquid properties and keep spraying quality constant.

Abstract: A low hysteresis piezo-electric pump using a piezo-electric element as an actuator to dispense a liquid may maintain accurate viscous liquid discharge characteristics by adjusting an applied voltage in response to changes in behavioral characteristics of a piezo-electric actuator depending on causes such as temperature change.

Abstract: Provided is a conductive ball mounting method using an electrostatic chuck. According to the conductive ball mounting method using an electrostatic chuck, when the process of mounting conductive balls onto a substrate through mounting grooves formed in the mask is performed, the occurrence of process defects can be prevented and conductive balls having very small sizes can be effectively mounted on the substrate. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting conductive balls can be performed with high quality by preventing deformation of the mask without missing of some of the conductive balls. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting small sizes of conductive balls on the substrate can be effectively performed.

Abstract: There is provided a laser apparatus for a printed electronic system according to an exemplary embodiment of the present invention including: a laser generating unit which oscillates a laser beam; a laser changing unit which changes an intensity or a wavelength of the laser beam oscillated from the laser generating unit; a laser control unit which controls the intensity or a magnitude of the wavelength of the laser beam which is changed by the laser changing unit; and a laser steering unit which changes a traveling direction of the laser beam output from the laser changing unit to be directed to a target, and the laser control unit controls the intensity or the magnitude of the wavelength of the laser beam in accordance with a state of a printing pattern formed on the target.

Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, and more specifically, to a substrate processing apparatus and a substrate processing method, for manufacturing a flexible circuit board, capable of manufacturing a flexible circuit board with a fine line width without undergoing a photolithographic process using a mask. The substrate processing apparatus and the substrate processing method, for manufacturing a flexible circuit board, according to the present disclosure, can efficiently manufacture a flexible circuit board having a fine line width at low costs.

Abstract: A printing apparatus for printed electronics according to the present invention may include: ejection head units which each have at least one nozzle for ejecting ink droplets to perform drop-on-demand or continuous printing; a jetting observation unit which is provided at one side of the nozzle and configured to observe the ink droplet ejected from the nozzle; a lighting unit which is provided at the other side of the nozzle and configured to provide light to the jetting observation unit; an alignment observation unit which is configured to observe an aligned state between the nozzle and a substrate; and a fluid supply unit which is configured to supply the ink to the nozzle, in which the ejection head units include a single-nozzle head unit, and a multi-nozzle head unit provided separately from the single-nozzle head unit.

Abstract: Provided is an apparatus for ejecting viscous liquid aerosol, and more particularly, an apparatus for ejecting viscous liquid aerosol capable of dispensing a viscous liquid to a work with a fine line width by ejecting the viscous liquid in the form of aerosols. The apparatus for ejecting viscous liquid aerosol may be configured compactly by miniaturizing a device capable of aerosolizing and ejecting viscous liquid in the form of aerosols. In addition, since the apparatus for ejecting viscous liquid aerosol has a structure that is easy to miniaturize, it is easy to uniformly maintain the characteristics of aerosol.

Abstract: Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam. The mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

Abstract: A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

Abstract: Provided is a dispensing apparatus capable of cleaning a nozzle, and more particularly, to a dispensing apparatus capable of cleaning a nozzle having the function of cleaning a nozzle of an apparatus for dispensing a viscous solution with a cleaning solution. The dispensing apparatus capable of cleaning a nozzle can effectively supply and manage a cleaning solution while effectively cleaning the viscous solution that are likely to be attached to the nozzle.

Abstract: Provided is a flip-chip laser bonding system for bonding a semiconductor chip in the form of a flip chip to a substrate using a laser beam. In the flip-chip laser bonding system, the semiconductor chip is laser-bonded to the substrate while pressure is applied to the semiconductor chip. Accordingly, even a semiconductor chip that is bent or is capable of being bent can be bonded to a semiconductor chip without contact failure.

Abstract: Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.

Abstract: The present disclosure relates to a viscous liquid dispensing method using a three-dimensional scanner, and more particularly, relates to a viscous liquid dispensing method using a three-dimensional scanner, in which a three-dimensional shape of a work, to which a viscous liquid is to be dispensed, is identified using the three-dimensional scanner, and, by using the identified result, the viscous liquid is dispensed to the work. The viscous liquid dispensing method using a three-dimensional scanner according to the present disclosure has the effect of improving the quality of a viscous liquid dispensing process by allowing the viscous liquid to be dispensed to a correct position of the work.

Abstract: Provided is a wafer level dispenser, and more particularly, a wafer level dispenser having a function of applying a viscous liquid to a semiconductor chip formed on a wafer by approaching the semiconductor chip on the wafer at various angles. According to the wafer level dispenser, a viscous liquid may be dispensed to a wafer or a semiconductor chip mounted on the wafer by adjusting an angle of a pump as desired.

Abstract: Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls.