Patents Assigned to Protectronics Technology Corporation
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Patent number: 7273538Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductive composite material having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductive composite material is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal layer to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.Type: GrantFiled: September 25, 2003Date of Patent: September 25, 2007Assignee: Protectronics Technology CorporationInventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
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Patent number: 7102483Abstract: An over-current protector comprised of multiple over-current protection devices each at various switching temperature and provided with positive temperature coefficient; all devices being stacked and segregated with an reinforced insulation layer and connected in parallel through a conducting mechanism each respectively provided at where in relation to both ends of the device; both conducting mechanisms constituting the terminal electrodes of the over-current protector as a whole for reducing initial resistance, increasing peak resistance, and in turn upgrading voltage withstanding performance.Type: GrantFiled: December 13, 2004Date of Patent: September 5, 2006Assignee: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Chien-Shan Huang, Rei-Yian Chen, Jui-Kuang Chang
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Patent number: 7069641Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.Type: GrantFiled: April 25, 2003Date of Patent: July 4, 2006Assignee: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Patent number: 6873244Abstract: The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.Type: GrantFiled: May 19, 2003Date of Patent: March 29, 2005Assignee: Protectronics Technology CorporationInventors: Chien-Shan Huang, Ren-Haur Hwang, Chih-Yi Chang
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Publication number: 20040069645Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductive composite material having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductive composite material is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal layer to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.Type: ApplicationFiled: September 25, 2003Publication date: April 15, 2004Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
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Patent number: 6686827Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.Type: GrantFiled: March 13, 2002Date of Patent: February 3, 2004Assignee: Protectronics Technology CorporationInventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
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Publication number: 20030227731Abstract: The invention discloses a surface mountable laminated circuit protection device by using a conductive composite material with PTC characteristics. The design of the invention enables the combinational arrangements of a top electrode, a bottom electrode and an insulating material between electrodes without using a conductive mechanism between the top electrode and the bottom electrodes to make a surface mountable polymeric circuit protection device, and can use the current double-layer metal-foil clad substrate as a processing substrate, make the processing of the protection device easier, and have better structural strength and dimension stability.Type: ApplicationFiled: May 5, 2003Publication date: December 11, 2003Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Chien-Shan Huang, Rei-Yian Chen, Chih-Yi Chang
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Publication number: 20030227368Abstract: The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.Type: ApplicationFiled: May 19, 2003Publication date: December 11, 2003Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Chien-Shan Huang, Ren-Haur Hwang, Chih-Yi Chang
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Publication number: 20030217457Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.Type: ApplicationFiled: April 25, 2003Publication date: November 27, 2003Applicant: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Patent number: 6602438Abstract: A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.Type: GrantFiled: December 7, 2001Date of Patent: August 5, 2003Assignee: Protectronics Technology CorporationInventor: Chen-Ron Lin
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Patent number: 6590491Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.Type: GrantFiled: January 24, 2002Date of Patent: July 8, 2003Assignee: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Publication number: 20030107466Abstract: A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.Type: ApplicationFiled: December 7, 2001Publication date: June 12, 2003Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventor: Chen-Ron Lin
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Publication number: 20020140540Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.Type: ApplicationFiled: March 13, 2002Publication date: October 3, 2002Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Rei-Yian Chen, Chih-Yi Chang, Tung-Hsiang Liu
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Publication number: 20020130757Abstract: The present invention discloses a surface mountable polymeric circuit protection device. The surface mountable polymeric circuit protection device is formed by configuring a conductive polymeric element having PTC features in combination with a top electrode, a bottom electrode and an insulative layer therebetween without conductive mechanisms between the top and the bottom electrodes.Type: ApplicationFiled: October 31, 2001Publication date: September 19, 2002Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Chien-Shan Huang, Ren-Haur Hwang, Chen-Ron Lin
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Publication number: 20020125983Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.Type: ApplicationFiled: January 24, 2002Publication date: September 12, 2002Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Publication number: 20020058208Abstract: The present invention discloses a polymeric circuit protection device and a method of making the same, wherein a highly conductive composite material and a conductive composite material of positive temperature coefficient thermal sensitive resistance are alternately stacked to form a plaque-shaped composite material, then two metal foils are laminated on top surface and bottom surface of the plaque-shaped composite material as electrodes to thereby form a sandwich-like laminated material. Moreover, a cross-linking process is made to cross-link the resin inside the composite material layer. Electrode trenches are etched, and an insulating layer is formed by using green paint in the electrode trenches to isolate different electrodes on the same surface of the device.Type: ApplicationFiled: October 1, 2001Publication date: May 16, 2002Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Chen-Ron Lin, Rei-Yian Chen, Ren-Haur Hwang, Chih-Yi Chang