Abstract: A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.