Patents Assigned to PS Japan Corporation
  • Publication number: 20230416515
    Abstract: Provided are a styrene-based resin composition that reduces environmental load by use of a biomass raw material and has excellent mechanical strength, and a molded article thereof. A styrene-based resin composition comprises: 82.5 mass % to 99.9 mass % of a styrene-based resin (A) containing a styrene-based monomer unit; and 0.1 mass % to 15 mass % of a biomass plasticizer (B) having a biomass carbon ratio (pMC %) of 10% or more.
    Type: Application
    Filed: November 30, 2021
    Publication date: December 28, 2023
    Applicant: PS JAPAN CORPORATION
    Inventors: Hirokazu IWAMOTO, Yu NAKAGAWA
  • Publication number: 20230099634
    Abstract: It would be helpful to provide a styrene-based resin molded body that has excellent dielectric constant, dielectric loss tangent, and color tone, and with little degradation in properties due to usage environment. The present disclosure is a styrene-based resin composition containing a styrene-based resin (A1) having styrene-based monomer units as repeating units. The styrene-based resin composition includes 6 ?g or less of a catechol derivative contained in the styrene-based resin (A1) per gram of the styrene-based resin (A1), and the total amount of dimers of the styrene-based monomer units and trimers of the styrene-based monomer units contained in the styrene-based resin (A1) is 5000 ?g or less per gram of the styrene-based resin (A1). The styrene-based resin composition has a dielectric constant of 3 or less and a dielectric loss tangent of 0.02 or less.
    Type: Application
    Filed: February 19, 2021
    Publication date: March 30, 2023
    Applicant: PS JAPAN CORPORATION
    Inventor: Akio NODERA
  • Patent number: 7790267
    Abstract: A workpiece boring/cutting operation aiding plate material comprising a rubber-containing styrene resin composition and an inorganic filler, wherein these are compounded in a weight ratio of 80:20 to 40:60; and a molding making use of the same.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: September 7, 2010
    Assignee: PS Japan Corporation
    Inventors: Yasuhito Kinpara, Makoto Iida
  • Patent number: 7754325
    Abstract: Disclosed is a rubber-modified styrene-based resin comprising a styrene-based polymer forming a matrix and rubber-like polymer particles dispersed in the matrix like islands, each of the rubber-like polymer particles having a cross sectional structure where the styrene-based polymer particles are contained like islands-sea, wherein the rubber-modified styrene-based resin is constituted of 1-10 wt % of the rubber-like polymer and 99-90 wt % of the styrene-based polymer; the particle-diameter of the rubber-like polymer particle falls within a range of 1.0 to 5.0 ?m; and a value of (styrene-based polymer weight/rubber-like polymer weight) in a methylethylketone-insoluble matter of the rubber-modified styrene-based resin falls within a range of 0.5 to 1.5.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: July 13, 2010
    Assignee: PS Japan Corporation
    Inventors: Mitsutoshi Toyama, Shinichi Nakayama
  • Patent number: 6933343
    Abstract: The present invention provides a method for manufacturing a styrene-based polymer having the steps of continuously feeding raw materials into one end of two or more polymerization vessels connected in series; polymerizing a styrenic monomer in the coexistence of a (meth)acrylate ester monomer by using an organic radical generating agent as an initiator by a mass or solution polymerization method of continuous process; and continuously taking out a product from another end of the polymerization vessels, wherein polymerization conditions are controlled in ranges specified by the following items (a) and (b): (a) a composition of monomers to be fed is 60 to 97% by weight of a styrenic monomer(s) and 3 to 40% by weight of a (meth)acrylate ester monomer(s); and (b) a concentration of the (meth)acrylate ester monomer(s) at any part of the polymerization vessels exceeds 1% by weight based on total monomers at any time during the polymerization.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: August 23, 2005
    Assignee: PS Japan Corporation
    Inventors: Takeshi Ikematsu, Toshiharu Kawasaki, Ikuji Ohtani, Mitsutoshi Toyama